For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
LINEAR & POWER AMPLIFIERS - SMT
11
11 - 273
Vdd (Vdc) Idd (mA)
+6.5 1330
+7.0 1300
+7.5 1285
Typical Supply Current vs. Vdd
Note: Ampli er will operate over full voltage ranges shown
above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V.
Power Dissipation*
5
6
7
8
9
10
11
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16
POWER DISSIPATION (W)
INPUT POWER (dBm)
11 GHz
Max Pdiss @ +85C
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, 2, 3, 4, 5) +8 Vdc
Gate Bias Voltage (Vgg) -2.0 to 0 Vdc
RF Input Power (RFIN)(Vdd = +7.0 Vdc) +20 dBm
Channel Temperature 150 °C
Continuous Pdiss (T= 85 °C)
(derate 154 mW/°C above 85 °C)
10 W
Thermal Resistance
(channel to ground paddle)
6.5 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C
Outline Drawing
* Refer to “Thermal Management for Surface Mount
Components” application note herein.
Part Number Package Body Material Lead Finish MSL Rating Package Marking
[3]
HMC487LP5 Low Stress Injection Molded Plastic Sn/Pb Solder
MSL1
[1]
H487
XXXX
HMC487LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
MSL1
[2]
H487
XXXX
[1] Max peak re ow temperature of 235 °C
[2] Max peak re ow temperature of 260 °C
[3] 4-Digit lot number XXXX
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Package Information
HMC487LP5 / 487LP5E
SURFACE MOUNT PHEMT 2 WATT POWER
AMPLIFIER, 9 - 12 GHz
v01.0705
ELECTROSTATIC SENSITIVE DEVICE
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