NZ3FxxxT1G Series, SZNZ3FxxxT1G Series
www.onsemi.com
3
PACKAGE DIMENSIONS
SOD−323FL
CASE 477AC
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
0.80
3.00
DIMENSION: MILLIMETERS
0.80
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN MAX
MILLIMETERS
D 2.00 2.20
E 1.30 1.60
A 0.90 1.08
b 0.50 0.70
c 0.10 0.25
L
H 2.40 2.80E
A1 −−− 0.10
0.35 0.65
E
D
A1
A
H
c
E
TOP VIEW
SIDE VIEW
BOTTOM VIEW
L
b
END VIEW
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