transimpedance amplifiers - chip
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, Norwood, MA 02062
978-250-3343 tel • 978-250-3373 fax • Order online at www.analog.com/hittitemw
Application Support: Phone: 978-250-3343 or RFMG-apps@analog.com
v02.1014
HMC6590
43 Gbps TRANSIMPEDANCE
AMPLIFIER
7
Mounting & Bonding Techniques for MMICs
The die should be attached directly to the ground plane with epoxy (see HMC
general Handling, Mounting , Bonding Note).
50 Ω Microstrip transmission lines on 0.254 mm (10 mil) thick alumina thin lm
substrates are recommended for bringing high speed differential signal from the
chip RF to and from the chip (Figure 1).
Microstrip substrates should be placed as close to the die as possible in order
to minimize bond wire length. Typical die-to-substrate spacing is 0.076 mm to
0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an ESD protective bag for shipment. Once the
sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: The chip may be handled by a vacuum collet or with a pair of sharp tweezers.
Mounting
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
