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VND830PEP-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
VND830PEP-E Package and PC board thermal data
Doc ID 10826 Rev 6 19/25
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 28. PowerSSO-24 PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area= 78mm x 78mm, PCB
thickness=2mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 29.
R
thj-amb
vs PCB copper area in open box
40
45
50
55
60
0123456789
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
Obsolete Product(s) - Obsolete Product(s)
Package and PC board thermal data VND830PEP-E
20/25 Doc ID 10826 Rev 6
Figure 30. PowerSSO-24 thermal impedance junction ambient single pulse
Figure 31. Thermal fitting model of a double channel HSD in PowerSSO-24
Equation 1
: pulse calculation formula
where δ = t
P
/T
0.1
1
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
Footprint
8 cm
2
Obsolete Product(s) - Obsolete Product(s)
VND830PEP-E Package and PC board thermal data
Doc ID 10826 Rev 6 21/25
Table 16. Thermal parameters
Area/island (cm
2
) Footprint 8
R1 = R7 (°C/W) 0.1
R2 = R8 (°C/W) 0.9
R3 (°C/W) 1
R4 (°C/W) 4
R5 (°C/W) 13.5
R6 (°C/W) 37 22
C1 = C7 (W.s/°C) 0.0006
C2 = C8 (W.s/°C) 0.0025
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.08
C5 (W.s/°C) 0.7
C6 (W.s/°C) 3 5
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25

VND830PEP-E

Mfr. #:
Buy VND830PEP-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers DOUBLE Ch Hi SIDE DRIVER
Lifecycle:
New from this manufacturer.
Delivery:
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