NSR05T30P2T5G

NSR05T30P2
www.onsemi.com
4
TYPICAL CHARACTERISTICS
−25°C
Figure 5. Forward Voltage Figure 6. Leakage Current
V
F
, FORWARD VOLTAGE (V) V
R
, REVERSE VOLTAGE (V)
0.40.30.10
0.1
1
10
100
1000
302520151050
0.00001
0.0001
0.01
V
R
, REVERSE VOLTAGE (V)
3020151050
0
5
10
25
35
I
F
, FORWARD CURRENT (mA)
I
R
, REVERSE CURRENT (mA)
C
T
, TOTAL CAPACITANCE (pF)
0.2
100°C
−55°C
85°C
25°C
125°C
−55°C
85°C
25°C
0.001
25
f = 1.0 MHz
0.5
0.1
1
10
100
15
20
30
40
Figure 7. Average Forward Power Dissipation Figure 8. Average Reverse Power Dissipation
I
F
, FORWARD CURRENT (mA) V
R
, REVERSE VOLTAGE (V)
300200150500
0.001
1
10
100
1000
302520151050
0.1
10
P
F
, AVERAGE FORWARD POWER (mW)
100
1.0
0.2 0.80.5
1
250
1000
Figure 9. Total Capacitance
150°C
150°C
−25°C
500400350 450
0.1
P
R
, AVERAGE REVERSE POWER
(mW)
Figure 10. Forward Surge Current
t
P
, PULSE ON TIME (ms)
10001001010.10.010.001
0
2
4
8
6
9
I
FSM
, FORWARD SURGE MAX CURRENT (A)
Based on square wave currents
T
J
= 25°C prior to surge
7
125°C
100°C
0.1
0.01
45
50
100
1.0
0.2 0.80.5
0.1
5
3
1
SOD923
CASE 514AB01
ISSUE C
DATE 11 MAR 2011
SCALE 8:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
GENERIC
MARKING DIAGRAM*
X = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
DIM MIN NOM MAX
MILLIMETERS
A 0.34 0.37 0.40
b 0.15 0.20 0.25
c 0.07 0.12 0.17
D 0.75 0.80 0.85
E 0.55 0.60 0.65
0.95 1.00 1.05
L 0.19 REF
H
E
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
MIN NOM MAX
INCHES
D
E
c
A
Y
X
21
X M
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
NO POLARITY
STYLE 1 STYLE 2
STYLE 1 STYLE 2
X M
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
See Application Note AND8455/D for more mounting details
1.20
2X
0.25
2X
0.36
PACKAGE
OUTLINE
b2X
0.08 XY
TOP VIEW
H
E
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
L2 0.05 0.10 0.15 0.002 0.004 0.006
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON23284D
ON SEMICONDUCTOR STANDARD
SOD923, 1.0X0.6X0.37, MAX HEIGHT 0.40
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON23284D
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. REQ. BY J. DAUGHERTY. 29 AUG 2006
A CHANGED DIMENSION A VALUES. REQ. BY D. TRUHITTE. 23 JAN 2007
B CREATED CATHODE AND NONCATHODE BAND VERSIONS.
REQ. BY J. DAUGHERTY.
07 MAR 2007
C ADDED BOTTOM VIEW AND DIMENSION L2. MODIFIED SOLDER FOOTPRINT.
REQ. BY D. TRUHITTE.
11 MAR 2011
© Semiconductor Components Industries, LLC, 2011
March, 2011 Rev. 01C
Case Outline Number:
514AB
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time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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NSR05T30P2T5G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Schottky Diodes & Rectifiers TRENCH SCHOTTKY
Lifecycle:
New from this manufacturer.
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