NCV896530
www.onsemi.com
3
PIN FUNCTION DESCRIPTION
Pin Pin Name Type Description
1 FB1 Analog Input Feedback voltage from the output 1. This is the input to the error amplifier.
2 EN1 Digital Input Enable for converter 1. This pin is active HIGH (equal or lower Analog Input voltage)
and is turned off by logic LOW.
Do not let this pin float.
3 SYNC Digital Input Oscillator Synchronization. This pin can be synchronized to an external clock in the
range of 2.1 MHz.
If not used, the pin must to be connected to ground.
4 VIN Analog / Power
Input
Power supply input for the PFET power stage, analog and digital blocks. The pin must
be decoupled to ground by a 10 mF ceramic capacitor.
5 SW1 Analog Output Connection from power MOSFETs of output 1 to the Inductor.
6 SW2 Analog Output Connection from power MOSFETs of output 2 to the Inductor.
7 GND Analog Ground This pin is the GROUND reference for the analog section of the IC. The pin must be
connected to the system ground.
8 POR Digital Output Power On Reset. This is an open drain output. This output is shutting down when one
of the output voltages are less than 90% (typ) of their nominal values. A pull−up resist-
or around 500 kW should be connected between POR and VIN, VOUT1 or VOUT2
depending on the supplied device.
9 EN2 Digital Input Enable for converter 2. This pin is active HIGH (equal or lower Analog Input voltage)
and is turned off by logic LOW.
Do not let this pin float.
10 FB2 Analog Input Feedback voltage from the output 2. This is the input to the error amplifier.
11 Exposed Pad Power Ground This pin is the GROUND reference for the NFET power stage of the IC. The pin must
be connected to the system ground and to both input and output capacitors.
MAXIMUM RATINGS
Rating Symbol Value Unit
Minimum Voltage All Pins V
min
−0.3 V
Maximum Voltage All Pins V
max
6.0 V
Maximum Voltage ENx, SYNC, FBx, , SWx, POR V
max
VIN+0.3 V
Thermal Resistance Junction−to−Ambient (3x3 DFN) (Note 1)
R
q
JA
40 °C/W
Storage Temperature Range T
stg
−55 to 150 °C
Junction Operating Temperature T
J
−40 to 150 °C
ESD Withstand Voltage
Human Body Model
Machine Model
V
esd
2.0
200
kV
V
Moisture Sensitivity Level MSL 3 per IPC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted on 1 sq. in. of a 4−layer PCB with 1 oz. copper thickness.
