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MC100ELT20DG

P1-P3P4-P6P7-P7
MC10ELT20, MC100ELT20
www.onsemi.com
4
Table 7. AC CHARACTERISTICS V
CC
= 4.75 V to 5.25 V; GND = 0.0 V
Symbo
l
Characteristic
−40°C 25°C 85°C
Uni
t
Min Typ Max Min Typ Max Min Typ Max
f
max
Maximum Toggle Frequency 100 100 100 MHz
t
PLH
Propagation Delay
1.5 V to 50%
0.6 0.82 1.2 0.6 0.82 1.25 0.6 0.83 1.35 ns
t
PHL
Propagation Delay
1.5 V to 50%
0.4 1.0 0.5 0.8 1.1 0.7 1.30 ns
t
JITTER
Cycle−to−Cycle Jitter TBD TBD TBD ps
t
r
/t
f
Output Rise/Fall Time
(20−80%)
0.15 1.5 0.15 1.5 0.15 1.5 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
− 2.0 V
MC10ELT20, MC100ELT20
www.onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
†
MC10ELT20DG SO−8
(Pb−Free)
98 Units / Rail
MC10ELT20DR2G SO−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT20DTG TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT20DTR2G TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT20DG SO−8
(Pb−Free)
98 Units / Rail
MC100ELT20DR2G SO−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT20DTG TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT20DTR2G TSSOP−8
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
MC10ELT20, MC100ELT20
www.onsemi.com
6
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
P1-P3P4-P6P7-P7

MC100ELT20DG

Mfr. #:
Buy MC100ELT20DG
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels 5V TTL to Diff PECL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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