MPX2053
Sensors
Freescale Semiconductor, Inc. 4
Pressure
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side relative to the vacuum side. Similarly, output voltage
increases as increasing vacuum is applied to the vacuum
side relative to the pressure side.
On-Chip Temperature Compensation and Calibration
Figure 2 shows the minimum, maximum and typical output
characteristics of the MPX2053 series at 25C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
Figure 2. Output vs. Pressure Differential
V
S
3
X-ducer
Sensing
Element
Thin Film
Temperature
Compensation
and
Calibration
2
4
V
out+
V
out-
1
GND
Output (mVdc)
kPa
PSI
40
35
30
25
15
10
5
0
-5
0 12.5
1.8
25
3.6
37.5
5.4
50
7.25
20
MAX
TYP
MIN
OFFSET
(TYP)
SPAN
RANGE
(TYP)
V
S
= 10 Vdc
T
A
= 25C
MPX2053
Sensors
5 Freescale Semiconductor, Inc.
Pressure
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: V
out
= V
off
+ sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 3) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. The
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Figure 3. Linearity Specification Comparison
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2053 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Refer to application note AN3728, for more information
regarding media compatibility.
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
Relative Voltage Output
Pressure (% Full scale)
0 50 100
End Point
Straight Line Fit
Exaggerated
Performance
Least Squares Fit
Straight Line
OFFSET
Least
Square
Deviation
Silicone
Die Coat Die
P1
P2
Wire Bond
Lead Frame
RTV Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
MPX2053
Sensors
6 Freescale Semiconductor, Inc.
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
A
M
0.136 (0.005)
T
1234
PIN 1
R
N
L
G
F
D
4 PL
SEATING
PLANE
-T-
C
M
J
B
-A-
DAMBAR TRIM ZONE:
F
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
1
23
4
Y
Z
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
STYLE 2:
PIN 1. V
CC
2. - SUPPLY
3. + SUPPLY
4. GROUND
STYLE 3:
PIN 1. GND
2. -VOUT
3. VS
4. +VOUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30˚ NOM 30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
Y 0.048 0.052 1.22 1.32
Z 0.106 0.118 2.68 3.00
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
D
4 PL
F
U
H
L
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010)
T
S
S
M
0.13 (0.005)
Q
S
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.230 0.250 5.84 6.35
S
U 0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
PACKAGE DIMENSIONS

MPXM2053D

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors COMPENSATED MINI-PAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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