2
Figure 1. SC Connector Block Diagram.
Transmitter Sections
The transmitter section of the AFBR-5803Z and AFBR-
5805Z series utilize 1300 nm Surface Emitting InGaAsP
LEDs. These LEDs are packaged in the optical subassem-
bly portion of the transmitter section. They are driven
by a custom silicon IC which converts dierential PECL
logic signals, ECL referenced (shifted) to a +3.3 V or +5 V
supply, into an analog LED drive current.
Receiver Sections
The receiver sections of the AFBR-5803Z and AFBR-
5805Z series utilize InGaAs PIN photodiodes coupled to
a custom silicon transimpedance preamplier IC. These
are packaged in the optical subassembly portion of the
receiver.
These PIN/preamplier combinations are coupled to
a custom quantizer IC which provides the nal pulse
shaping for the logic output and the Signal Detect
function. The data output is dierential. The signal detect
output is single-ended. Both data and signal detect
outputs are PECL compatible, ECL referenced (shifted) to
a +3.3 V or +5 V power supply.
Package
The overall package concept for the Avago Technologies
transceivers consists of the following basic elements; two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure 1 and Figure 1a.
The package outline drawings and pin out are shown in
Figures 2, 2a and 3. The details of this package outline
and pin out are compliant with the multisource denition
of the 1 x 9 SIP. The low prole of the Avago Technologies
transceiver design complies with the maximum height
allowed for the duplex SC connector over the entire
length of the package.
The optical subassemblies utilize a high volume assembly
process together with low cost lens elements which
result in a cost eective building block.
The electrical subassembly consists of a high volume
multilayer printed circuit board on which the IC chips
and various surface-mounted passive circuit elements
are attached.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI elds.
The outer housing including the duplex SC connector
receptacle or the duplex ST ports is molded of lled
nonconductive plastic to provide mechanical strength
and electrical isolation. The solder posts of the Avago
Technologies design are isolated from the circuit design
of the transceiver and do not require connection to a
ground plane on the circuit board.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the transceiver by mating with duplex or
simplex SC or ST connectored ber cables.
TOP VIEW
PIN PHOTODIODE
DUPLEX SC
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP IC
DATA OUT
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
DIFFERENTIAL
SINGLE-ENDED
DIFFERENTIAL
