AOWF15S60

AOW15S60/AOWF15S60
600V 15A
α
αα
α
MOS
TM
Power Transistor
General Description Product Summary
V
DS
@ T
j,max
700V
I
DM
63A
R
DS(ON),max
0.29
Q
g,typ
16nC
E
oss
@ 400V 3.6µJ
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
E
AS
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt
H
T
J
, T
STG
T
L
Symbol
R
θJA
R
θCS
R
θJC
* Drain current limited by maximum junction temperature.
Single pulsed avalanche energy
G
W
86
P
D
Repetitive avalanche energy
C
27.8208
mJ
mJ
Avalanche Current
C
10*10
Junction and Storage Temperature Range
T
C
=25°C
dv/dt
1.67
20
Power Dissipation
B
173
Gate-Source Voltage V
A
63
T
C
=100°C
Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
I
D
600
15*15
A2.4
±30
°C
The AOW15S60 & AOWF15S60 have been fabricated
using the advanced αMOS
TM
high voltage process that is
designed to deliver high levels of performance and
robustness in switching applications.
By providing low R
DS(on)
, Q
g
and E
OSS
along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
AOW15S60 AOWF15S60
Drain-Source Voltage
°C/W
W/
o
C
°C
Thermal Characteristics
0.5 -- °C/W
Maximum Junction-to-Case
0.6 4.5
°C/W
Derate above 25
C
Parameter AOW15S60
0.22
-55 to 150
AOWF15S60
100
Units
V/ns
Maximum Case-to-sink
A
Maximum Junction-to-Ambient
A,D
300
65 65
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
J
G
D
S
Top View
TO-262
Bottom View
G
D
S
G
D
S
Top View
TO-262F
Bottom View
G
D
S
G
D
S
AOWF15S60
AOW15S60
Rev 0: Aug 2011
www.aosmd.com
Page 1 of 6
AOW15S60/AOWF15S60
Symbol Min Typ Max Units
600 - -
650 700 -
- - 1
- 10 -
I
GSS
Gate-Body leakage current
- - ±100
nΑ
V
GS(th)
Gate Threshold Voltage
2.5 3.2 3.8 V
- 0.254 0.29
- 0.68 0.78
V
SD
- 0.83 - V
I
S
Maximum Body-Diode Continuous Current - - 15 A
I
SM
- - 63 A
C
iss
- 717 - pF
C
oss
- 58 - pF
C
o(er)
- 41.2 - pF
C
o(tr)
- 125.2 - pF
C
rss
- 1.3 - pF
R
g
- 13.4 -
Q
g
- 15.6 - nC
Q
gs
- 3.5 - nC
Q
gd
- 6.0 - nC
t
D(on)
- 24.5 - ns
t
r
- 22 - ns
t
D(off)
- 84 - ns
t
f
- 24 - ns
t
rr
- 282
- ns
I
rm
- 26
- A
Q
rr
- 4.5
-
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Peak Reverse Recovery Current
I
F
=7.5A,dI/dt=100A/µs,V
DS
=400V
V
V
GS
=10V, I
D
=7.5A, T
J
=150°C
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
µA
V
DS
=0V, V
GS
=±30V
V
DS
=600V, V
GS
=0V
V
DS
=5V,I
D
=250µA
V
DS
=480V, T
J
=150°C
Zero Gate Voltage Drain Current
Body Diode Reverse Recovery Charge
I
F
=7.5A,dI/dt=100A/µs,V
DS
=400V
Maximum Body-Diode Pulsed Current
C
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime
Body Diode Reverse Recovery Time
I
F
=7.5A,dI/dt=100A/µs,V
DS
=400V
Reverse Transfer Capacitance
BV
DSS
V
GS
=10V, V
DS
=400V, I
D
=7.5A,
R
G
=25
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=480V, I
D
=7.5A
Gate Source Charge
Gate Drain Charge
V
GS
=10V, I
D
=7.5A, T
J
=25°C
SWITCHING PARAMETERS
I
DSS
Effective output capacitance, time
related
I
R
DS(ON)
Static Drain-Source On-Resistance
I
S
=7.5A,V
GS
=0V, T
J
=25°C
Diode Forward Voltage
Input Capacitance
V
GS
=0V, V
DS
=100V, f=1MHz
Output Capacitance
VGS=0V, V
DS
=100V, f=1MHz
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
D
=250µA, V
GS
=0V, T
J
=150°C
Effective output capacitance, energy
related
H
VGS=0V, V
DS
=0 to 480V, f=1MHz
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedance from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, I
AS
=2.4A, V
DD
=150V, Starting T
J
=25°C
H. C
o(er)
is a fixed capacitance that gives the same stored energy as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS.
I. C
o(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS.
J. Wavesoldering only allowed at leads.
Rev 0: Aug 2011 www.aosmd.com Page 2 of 6
AOW15S60/AOWF15S60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
5
10
15
20
25
30
0 5 10 15 20
V
DS
(Volts)
Figure 1: On-Region Characteristics@25°C
I
D
(A)
V
GS
=4.5V
6V
10V
7V
0.01
0.1
1
10
100
2 4 6 8 10
V
GS
(Volts)
Figure 3: Transfer Characteristics
I
D
(A)
-55°C
V
DS
=20V
25°C
125°C
0.0
0.2
0.4
0.6
0.8
1.0
0 5 10 15 20 25 30 35
I
D
(A)
Figure 4: On-Resistance vs. Drain Current and
Gate Voltage
R
DS(ON)
(
)
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Temperature (°C)
Figure 5: On-Resistance vs. Junction Temperature
Normalized On-Resistance
V
GS
=10V
I
D
=7.5A
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
T
J
(
o
C)
Figure 6: Break Down vs. Junction Temperature
BV
DSS
(Normalized)
0
5
10
15
20
25
0 5 10 15 20
V
DS
(Volts)
Figure 2: On-Region Characteristics@125°C
I
D
(A)
V
GS
=4.5V
5V
10V
6V
5V
5.5V
5.5V
7V
Rev 0: Aug 2011 www.aosmd.com Page 3 of 6

AOWF15S60

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 600V 15A TO262F
Lifecycle:
New from this manufacturer.
Delivery:
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