MAX9993ETP+TD Datasheet MAX9993ETP+TD | P7-P9

MAX9993

High-Linearity 1700MHz to 2200MHz Down-

Conversion Mixer with LO Buffer/Switch

_______________________________________________________________________________________ 7

SUPPLY CURRENT vs. TEMPERATURE

MAX9993 toc36

TEMPERATURE (°C)

SUPPLY CURRENT (mA)

603510-15

185

190

195

200

205

180

-40 85

= 5.25V

= 5.0V

= 4.75V

LO RETURN LOSS vs. LO FREQUENCY

MAX9993 toc35

LO FREQUENCY (MHz)

LO RETURN LOSS (dB)

230022002100200019001800170016001500

1400 2400

LO INPUT UNSELECTED

= 0dBm, +3dBm, +6dBm

LO RETURN LOSS vs. LO FREQUENCY

MAX9993 toc34

LO FREQUENCY (MHz)

LO RETURN LOSS (dB)

230022002100200019001800170016001500

1400 2400

= +6dBm

= +3dBm

= 0dBm

LO INPUT SELECTED

IF RETURN LOSS vs. IF FREQUENCY

MAX9993 toc33

IF FREQUENCY (MHz)

IF RETURN LOSS (dB)

32530027525022520017515012510075

50 350

= 4.75V

= 5.0V

= 5.25V

MAX9993 EV KIT

(TUNED FOR 70MHz - 100MHz IF)

SET BY EXTERNAL MATCHING COMPONENTS

RF RETURN LOSS vs. RF FREQUENCY

MAX9993 toc32

RF FREQUENCY (MHz)

RF RETURN LOSS (dB)

215021001750 1800 1850 1950 20001900 2050

1700 2200

= +6dBm

= +3dBm

= 0dBm

LOW-SIDE

INJECTION LO FOR

200MHz IF

NOISE FIGURE vs. RF FREQUENCY

HIGH-SIDE INJECTION

MAX9993 toc31

RF FREQUENCY (MHz)

NOISE FIGURE (dB)

215021002050200019501900185018001750

1700 2200

= +25°C

= -40°C

= +85°C

NOISE FIGURE vs. RF FREQUENCY

LOW-SIDE INJECTION

MAX9993 toc30

RF FREQUENCY (MHz)

NOISE FIGURE (dB)

215021002050200019501900185018001750

1700 2200

= +6dBm

= +3dBm

= 0dBm

NOISE FIGURE vs. RF FREQUENCY

LOW-SIDE INJECTION

MAX9993 toc29

RF FREQUENCY (MHz)

NOISE FIGURE (dB)

215021002050200019501900185018001750

1700 2200

= 4.75V

= 5.25V

= 5.0V

NOISE FIGURE vs. RF FREQUENCY

LOW-SIDE INJECTION

MAX9993 toc28

RF FREQUENCY (MHz)

NOISE FIGURE (dB)

215021002050200019501900185018001750

1700 2200

= +25°C

= -40°C

= +85°C

Typical Operating Characteristics (continued)

(MAX9993 EV Kit, V

= 5.0V, P

= -5dBm, P

= +3dBm, LO is low-side injected for a 200MHz IF, T

= +25°C. For high-side LO

injection curves, LO frequency is beyond maximum specified range, and is shown for completeness.)

MAX9993

Detailed Description

The MAX9993 high-linearity down-conversion mixer pro-

vides 8.5dB of gain and +23.5dBm IIP3, with a 9.5dB

noise figure (typ). Integrated baluns and matching cir-

cuitry allow 50Ω single-ended interfaces to the RF and

LO ports. A single-pole, double-throw (SPDT) LO switch

provides 50ns switching time between LO inputs, with

typically 40dB LO-to-LO isolation. Furthermore, the inte-

grated LO buffer provides a high drive level to the mixer

core, reducing the LO drive required at the MAX9993’s

inputs to 0dBm to +6dBm range. The IF port incorpo-

rates a differential output, which is ideal for providing

enhanced IIP2 performance.

Specifications are guaranteed over broad frequency

ranges to allow for use in UMTS and 2G/2.5G/3G

DCS1800 and PCS1900 base stations. The MAX9993 is

specified to operate over an RF input range of

1700MHz to 2200MHz, an LO range of 1400MHz to

2000MHz, and an IF range of 40MHz to 350MHz. This

device can operate in high-side LO injection applica-

tions with an extended LO range, but performance

degrades gently as f

continues to increase. See the

Typical Operating Characteristics for measurements

taken with f

up to 2400MHz. This device is available

in a compact 5mm

5mm 20-pin thin QFN package

with an exposed pad.

RF Input and Balun

The MAX9993 has one input (RF) that is internally

matched to 50Ω, requiring no external matching com-

ponents. A DC-blocking capacitor is required, because

the input is internally DC shorted to ground through the

on-chip balun. Input return loss is better than 15dB over

the entire RF frequency range of 1700MHz to 2200MHz.

LO Input, Switch, Buffer, and Balun

The mixer can be used for either high-side or low-side

injection applications with an LO frequency range of

1400MHz to 2000MHz. An internal LO SPDT switch

selects one of two single-ended LO ports. This allows

the external oscillator to settle on a particular frequency

before it is switched in. LO switching time is guaran-

teed to be less than 50ns. This switch is controlled by a

digital input (LOSEL): logic low selects LO1, logic high

selects LO2. LO1 and LO2 inputs are internally

matched to 50Ω, requiring only a 22pF DC-blocking

capacitor.

A two-stage internal LO buffer allows a wide input power

range for the LO drive. All guaranteed specifications are

for an LO signal power from 0dBm to +6dBm. A low-loss

balun along with an LO buffer drives the double-balanced

mixer. All interfacing and matching from the LO inputs to

the IF outputs are integrated on-chip.

High-Linearity 1700MHz to 2200MHz Down-

Conversion Mixer with LO Buffer/Switch

8 _______________________________________________________________________________________

PIN NAME FUNCTION

1, 6, 8 V

Power Supply Connections. See the Typical Application Circuit.

2RF

Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a

balun. Provide a DC-blocking capacitor if required.

3 TAP

Center Tap of the Internal RF Balun. Bypass with capacitors close to the IC, as shown in the

Typical Application Circuit.

4, 5, 10, 12,

13, 14, 17, EP

GND

Ground. Connect to supply ground. Provide multiple vias in the PC board to create a low-

inductance connection between the exposed paddle (EP) and the PC board ground.

7 LOBIAS LO Output Bias Resistor for LO Buffer. Connect a 383Ω (±1%) from LOBIAS to GND.

9 LOSEL LO Select. Logic control input for selecting LO1 or LO2.

11 LO1 Local Oscillator Input. LO1 selected when LOSEL is low.

15 LO2 Local Oscillator Input. LO2 selected when LOSEL is high.

16 LEXT

External Inductor Connection. Connect a low-ESR 10nH inductor from LEXT to GND. This inductor

carries approximately 100mA DC current.

18 IF-

Noninverting IF Output. Requires external bias to V

through an RF choke (see the Typical

Application Circuit).

19 IF+

Inverting IF Output. Requires external bias to V

through an RF choke (see the Typical

Application Circuit).

20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect a 523Ω (±1%) from IFBIAS to GND.

Pin Description

High-Linearity Mixer

The core of the MAX9993 is a double-balanced, high-

performance passive mixer. Exceptional linearity is pro-

vided by the large LO swing from the on-chip LO

buffer; IIP3 is typically +23.5dBm, IIP2 is typically

+60dBm, and total cascaded NF is 9.5dB.

Differential IF Output Amplifier

The MAX9993 mixer has an IF frequency range of 40MHz

to 350MHz. The differential, open-collector IF output ports

require external pullup inductors to V

. Single-ended IF

applications require a 4:1 balun to transform the 200Ω

differential output impedance to a 50Ω single-ended out-

put. After the balun, VSWR is typically 1.5:1.

Applications Information

Input and Output Matching

The RF and LO inputs are internally matched to 50Ω.

No matching components are required. Return loss at

the RF port is better than 15dB over the entire input

range, 1700MHz to 2200MHz, and return loss at LO1

and LO2 is better than 10dB from 1400MHz to

2000MHz. RF and LO inputs require only DC-blocking

capacitors for interfacing. These DC-blocking capaci-

tors can be part of the matching circuit.

The IF output impedance is 200Ω differential out of the

IC. An external low-loss 4:1 balun brings this imped-

ance down to a 50Ω single-ended output (see the

Typical Application Circuit).

Bias Resistors

Bias currents for the LO buffer and the IF amplifier were

optimized by fine-tuning the resistors at LOBIAS and

IFBIAS during characterization at the factory. These cur-

rents should not be adjusted. If the 383Ω (±1%) and/or

523Ω (±1%) resistor values are not readily available,

substitute standard ±5% values: 390Ω and 520Ω,

respectively.

Layout Considerations

A properly designed PC board is an essential part of

any RF/microwave circuit. Keep RF signal lines as short

as possible to reduce losses, radiation, and induc-

tance. For best performance, route the ground pin

traces directly to the exposed pad underneath the

package. This pad should be connected to the ground

plane of the board by using multiple vias under the

device to provide the best RF/thermal conduction path.

Solder the exposed pad on the bottom of the device

package to a PC board exposed pad.

Power Supply Bypassing

Proper voltage supply bypassing is essential for high-

frequency circuit stability. Bypass each V

pin and

TAP with the capacitors shown in the typical application

circuit. Place the TAP bypass capacitor to ground with-

in 100 mils of the TAP pin.

Chip Information

TRANSISTOR COUNT: 989

PROCESS: SiGe BiCMOS

MAX9993

High-Linearity 1700MHz to 2200MHz Down-

Conversion Mixer with LO Buffer/Switch

_______________________________________________________________________________________ 9

COMPONENT VALUE SIZE DESCRIPTION

C1 4pF 0603 Microwave capacitor

C2, C6, C7, C9, C10 22pF 0603 Microwave capacitors

C3, C5, C8 0.01µF 0603 Capacitors

C4 10pF 0603 Microwave capacitor

C11, C12, C13 150pF 0603 Microwave capacitors

L1, L2 470nH 1008 Wire-wound high-Q inductors

L3 10nH 0805 Wire-wound high-Q inductor

R1 523Ω 0603 ±1% resistor

R2 383Ω 0603 ±1% resistor

R3, R4 7.2Ω 1206 ±1% resistors

R5 200Ω 0603 ±5% resistor

T1 4:1 (200:50) — IF balun

Table 1. Component List

P1-P3 P4-P6 P7-P9 P10-P12

MAX9993ETP+TD

Mfr. #:

Buy MAX9993ETP+TD

Manufacturer:

Maxim Integrated

Description:

Up-Down Converters 1700-2200MHz Downconversion Mixer

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MAX9993ETP+TD