AO4443
Symbol Min Typ Max Units
BV
DSS
-40 V
V
DS
=-40V, V
GS
=0V -1
T
J
=55°C -5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage
-1.5 -2 -2.6 V
I
D(ON)
40 A
35 42
T
J
=125°C 53 65
46.5 63 mΩ
g
FS
17 S
V
SD
-0.76 -1 V
I
S
-3.5 A
C
iss
750 940 1175 pF
C
oss
97 pF
C
rss
72 pF
R
g
7 14 21 Ω
Q
g(10V)
17.3 22 nC
Qg
(4.5V)
8.4 11
Q
gs
3.2 nC
Q
gd
4.3 nC
t
D(on)
10.3 ns
V
GS
=0V, V
DS
=-20V, f=1MHz
SWITCHING PARAMETERS
V
DS
=V
GS
I
D
=-250µA
V
GS
=-4.5V, I
D
=-5A
Forward Transconductance
V
GS
=-10V, I
D
=-6A
Reverse Transfer Capacitance
Maximum Body-Diode Continuous Current
mΩ
DYNAMIC PARAMETERS
Turn-On DelayTime
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
V
DS
=-5V, I
D
=-6A
R
DS(ON)
Static Drain-Source On-Resistance
Total Gate Charge
V
GS
=-10V, V
DS
=-20V, I
D
=-6A
Gate Source Charge
Gate Drain Charge
I
S
=-1A,V
GS
=0V
Diode Forward Voltage
Input Capacitance
Output Capacitance
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
µA
Zero Gate Voltage Drain Current
Drain-Source Breakdown Voltage
On state drain current
I
D
=-250µA, V
GS
=0V
V
GS
=-10V, V
DS
=-5V
V
DS
=0V, V
GS
=±20V
Gate-Body leakage current
r
t
D(off)
39 ns
t
f
46.5 ns
t
rr
17 24 ns
Q
rr
11.5
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
I
F
=-6A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge
Body Diode Reverse Recovery Time
I
F
=-6A, dI/dt=100A/µs
GS
DS
R
L
=3.35Ω, R
GEN
=3Ω
Turn-Off DelayTime
Turn-Off Fall Time
A. The value of R
θJA
is measured with the device mounted on 1in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C. Ratings are based on low frequency and duty cycles to keep
initialT
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to lead R
θJL
and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2
FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
Rev 4: August 2011 www.aosmd.com Page 2 of 5
