ICS-40180
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (V
DD
)
0.3 V to +3.63 V
Sound Pressure Level
160 dB
Mechanical Shock
10,000 g
Vibration
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
40°C to +85°C
Storage
55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 14
Document Number: DS-000021
Revision: 1.2
ICS-40180
SOLDERING PROFILE
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (T
L
to T
P
)
1.25°C/sec max
1.25°C/sec max
Preheat
Minimum Temperature
(T
SMIN
)
100°C 100°C
Minimum Temperature
(T
SMIN
)
150°C 200°C
Time (T
SMIN
to T
SMAX
), t
S
60 sec to 75 sec 60 sec to 75 sec
Ramp-Up Rate (T
SMAX
to T
L
) 1.25°C/sec 1.25°C/sec
Time Maintained Above Liquidous (t
L
) 45 sec to 75 sec ~50 sec
Liquidous Temperature (T
L
)
183°C
217°C
Peak Temperature (T
P
)
215°C +3°C/−3°C 260°C +0°C/5°C
Time Within +5°C of Actual Peak
Temperature (t
P
)
20 sec to 30 sec
20 sec to 30 sec
Ramp-Down Rate 3°C/sec max
3°C/sec max
Time +25°C (t
25°C
) to Peak Temperature 5 min max
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J-STD-020 profile
t
P
t
L
t
25°C
TO PEAK TEMPERATURE
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
Page 5 of 14
Document Number: DS-000021
Revision: 1.2
ICS-40180
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Top View (Terminal Side Down)
Not to Scale
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME FUNCTION
1 OUTPUT Analog Output Signal
2 GND Ground
3 GND Ground
4 GND Ground
5
VDD
Power Supply
OUTPUT
VDD
GND
1
2
3
5
4
GND
GND
Page 6 of 14
Document Number: DS-000021
Revision: 1.2

ICS-40180

Mfr. #:
Manufacturer:
TDK InvenSense
Description:
MIC MEMS ANALOG OMNI -38DB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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