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MCS04020D4530BE100

P1-P3P4-P6P7-P9P10-P11
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com
Vishay Beyschlag
Revision: 16-Aug-16
7
Document Number: 28700
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4.23
Climatic
sequence:
standard
operation mode:
4.23.2 2 (Bb) Dry heat 125 °C; 16 h
± (0.1 % R + 0.02 ) ± (0.25 % R + 0.05 )
4.23.3 30 (Db)
Damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold -55 °C; 2 h
4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db)
Damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
5 cycles
4.23.7 - DC load
U = U
max.
;
1 min.
- 1 (Aa) Cold -55 °C; 2 h ± (0.05 % R + 0.01 )
4.19 14 (Na)
Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = -10 °C;
UCT = 85 °C;
5 cycles
± (0.05 % R + 0.01 )
no visible damage
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
± (0.25 % R + 0.05 )
no visible damage
4.13 -
Short time
overload:
precision
operation mode
U = 2.5 x
or U = 2 x U
max.
;
whichever is the less severe;
5 s
±(0.05 % R + 0.01 )
Short time
overload:
standard
operation mode
U = 2.5 x
or U = 2 x U
max.
;
whichever is the less severe;
5 s
±(0.05 % R + 0.01 )
4.27 -
Single pulse high
voltage overload:
standard
operation mode
Severity no. 4:
U = 10 x
or U = 2 x U
max.
;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.5 % R + 0.05 )
no visible damage
4.39 -
Periodic electric
overload:
standard
operation mode
U =
or U = 2 x U
max.
;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05 )
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.1 STABILITY CLASS 0.25
Stability for product types:
MCS 0402 100 to 10 k > 10 kto 221 k
MCT 0603 100 to 10 k
39 to < 100 ;
> 10 k to 511 k
MCU 0805 100 to 47.5 k
39 to < 100 ;
> 47.5 k to 1.5 M
MCA 1206 47 to 332 k
39 to < 47 ;
> 332 k to 2 M
P
70
x R
P
70
x R
P
70
x R
P
70
x R
15 x P
70
x R
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com
Vishay Beyschlag
Revision: 16-Aug-16
8
Document Number: 28700
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.38 -
Electro static
discharge
(human body
model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402: 500 V
MCT 0603: 1000 V
MCU 0805: 1500 V
MCA 1206: 2000 V
±(0.5 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s
2
;
7.5 h
± (0.05 % R + 0.01 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
4.18 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
±(0.05 % R + 0.01 )
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol; + 50 °C;
method 2
No visible damage
4.32 21 (Ue
3
)
Shear
(adhesion)
MCS 0402 and MCT 0603;
9 N
No visible damage
MCU 0805 and MCA 1206;
45 N
No visible damage
4.33 21 (Ue
1
)
Substrate
bending
Depth 2 mm, 3 times
±(0.05 % R + 0.01 )
no visible damage, no open circuit in bent position
4.7 - Voltage proof U
RMS
= U
ins
; (60 ± 5) s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
,
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.1 STABILITY CLASS 0.25
Stability for product types:
MCS 0402 100 to 10 k > 10 kto 221 k
MCT 0603 100 to 10 k
39 to < 100 ;
> 10 k to 511 k
MCU 0805 100 to 47.5 k
39 to < 100 ;
> 47.5 k to 1.5 M
MCA 1206 47 to 332 k
39 to < 47 ;
> 332 k to 2 M
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
www.vishay.com
Vishay Beyschlag
Revision: 16-Aug-16
9
Document Number: 28700
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x
(1)
,
or in publication IPC-7351.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
W
T
(mm)
T
t
(mm)
T
b
(mm)
MASS
(mg)
MCS 0402 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1 / - 0.15 0.2 ± 0.1 0.6
MCT 0603 0.45 + 0.1 / - 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15 / - 0.2 0.3 + 0.15 / - 0.2 1.9
MCU 0805 0.45 + 0.1 / - 0.05 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1 / - 0.2 0.4 + 0.1 / - 0.2 4.6
MCA 1206 0.55 ± 0.1 3.2 + 0.1 / - 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 - - - - 0.35 0.55 0.55 1.45
MCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
T
b
T
t
L
H
W
W
T
G
X
Y
Z
P1-P3P4-P6P7-P9P10-P11

MCS04020D4530BE100

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