NB4L339
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4
Table 5. ATTRIBUTES
Characteristics Value
Input Default State Resistors
80 k
ESD Protection Human Body Model
Machine Model
> 2.0 kV
> 100 V
Moisture Sensitivity (Note 2) QFN32 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 366
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 6. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Units
V
CC
Positive Power Supply V
EE
= 0 V 4.0 V
V
IO
Input/Output Voltage V
EE
= 0 V 0.5 = V
Io
V
CC
+ 0.5 4.0 V
V
INPP
Differential Input Voltage Swing |CLK CLK| 2.8 V
I
IN
Input Current Through R
T
(50 Resistor)
Static
Surge
45
80
mA
I
OUT
Output Current Continuous
Surge
50
100
mA
T
A
Operating Temperature Range QFN32 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
JA
Thermal Resistance (JunctiontoAmbient) (Note 3) 0 LFPM
500 LFPM
QFN32
QFN32
31
27
°C/W
JC
Thermal Resistance (JunctiontoCase) (Note 3) QFN32 12 °C/W
T
sol
Wave Solder (PbFree) 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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Table 7. DC CHARACTERISTICS, CLOCK Inputs, LVPECL Outputs
V
CC
= 2.375 V to 3.6 V, V
EE
= 0 V, T
A
= 40°C to +85°C (Note 5)
Symbol Characteristic Min Typ Max Unit
I
EE
Power Supply Current (Inputs and Outputs Open) 58 70 90 mA
LVPECL Outputs (Note 4)
V
OH
Output HIGH Voltage
V
CC
= 3.3 V
V
CC
= 2.5 V
V
CC
1135
2155
1355
V
CC
1020
2280
1480
V
CC
760
2540
1740
mV
V
OL
Output LOW Voltage
V
CC
= 3.3 V
V
CC
= 2.5 V
V
CC
1935
1355
555
V
CC
1770
1530
730
V
CC
1560
1740
940
mV
Differential Input Driven SingleEnded (see Figures 6 & 8)
Vth Input Threshold Reference Voltage Range (Note 6) 1125 V
CC
75 mV
V
IH
Singleended Input HIGH Voltage Vth + 75 V
CC
mV
V
IL
Singleended Input LOW Voltage V
EE
Vth 75 mV
V
ISE
Singleended Input Voltage (V
IH
V
IL
) 150 2800 mV
Differential Inputs Driven Differentially (see Figures 7 & 9)
V
IHD
Differential Input HIGH Voltage 1200 V
CC
mV
V
ILD
Differential Input LOW Voltage V
EE
V
CC
150 mV
V
CMR
Input Common Mode Range (Differential Configuration) (Note 8) 1125 V
CC
75 mV
V
ID
Differential Input Voltage Swing (V
IHD
V
ILD
) 150 2800 mV
I
IH
Input HIGH Current CLKx / CLKx (VTx Open) 10 40
A
I
IL
Input LOW Current CLKx / CLKx (VTx Open) 10 10
A
SingleEnded LVCMOS / LVTTL Control Inputs
V
IH
Singleended Input HIGH Voltage 2000 V
CC
mV
V
IL
Singleended Input LOW Voltage V
EE
800 mV
I
IH
Input HIGH Current CLKSEL, DIVSEL, EN
MR
40
10
115
10
A
I
IL
Input LOW Current CLKSEL, DIVSEL, EN
MR
10
115
10
40
A
Termination Resistors
R
TIN
Internal Input Termination Resistor (Measured across CLKx and CLKx) 80 100 120
R
TIN
Internal Input Termination Resistor (Measured from CLKx to VTx) 40 50 60
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. LVPECL outputs require 50 receiver termination resistors to V
CC
2 V for proper operation.
5. Input and output parameters vary 1:1 with V
CC
.
6. Vth is applied to the complementary input when operating in singleended mode.
7. V
IHD
, V
ILD,
V
ID
and V
CMR
parameters must be complied with simultaneously.
8. V
CMR
min varies 1:1 with V
EE
, V
CMR
max varies 1:1 with V
CC
. The V
CMR
range is referenced to the most positive side of the differential input
signal.
NB4L339
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6
Table 8. AC CHARACTERISTICS V
CC
= 2.375 V to 3.6 V, V
EE
= 0 V (Note 9)
Symbol Characteristic
40_C 25_C 85_C
Unit
Min Typ Max Min Typ Max Min Typ Max
fin
max
Maximum Input CLOCK Frequency 700 700 700 MHz
V
OUTPP
Output Voltage Amplitude (@ V
INPPmin
)
(See Figure 4) f
in
622 MHz 530 730 530 730 530 730
mV
t
PLH
,
t
PHL
Propagation Delay to CLKx/CLKx to Qx/Qx
Output Differential ÷ 1MR to Qx
CLKSEL to Qx
0.8
1.2
0.8
1.0
1.0
1.3
5.0
1.3
0.8
1.2
0.8
1.0
1.0
1.3
5.0
1.3
0.8
1.2
0.8
1.0
1.0
1.3
5.0
1.3
ns
trr Reset Recovery 4.0 4.0 4.0 ns
DCO Output CLOCK Duty Cycle All Divides 40 60 40 60 40 60 %
t
SKEW
Within Device Skew (Note 11)
Device to Device Skew (Note 12)
30
90
60
190
30
90
60
190
30
90
60
190
ps
t
s
Setup Time @ 50 MHz EN to CLKx
DIVSEL to CLKx
900
100
900
100
900
100
ps
t
h
Hold Time @ 50 MHz CLKx to EN
CLKx to DIVSEL
800
0
800
0
800
0
ps
t
PW
Minimum Pulse Width MR 5.0 5.0 5.0 ns
N
Phase Noise f
in
= 622.08 MHz
Outputs (A) Div by 1
10 kHz
100 kHz
1 MHz
10 MHz
20 MHz
40 MHz
136
136
141
141
141
141
dBc
t
JIT1
Integrated Phase Jitter (Figure 4)
f
in
= 622.08 MHz, 12 kHz 20 MHz Offset
All Divides 0.15 0.25 0.15 0.25 0.15 0.25
ps
RMS
t
JIT2
Random Clock Period Jitter (Note 13)
f
in
= 622.08 MHz All Divides 0.5 1.5 0.5 1.5 0.5 1.5
ps
RMS
V
INPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 14)
150 150 150 mV
t
r
, t
f
Output Rise/Fall Times @ 622.08 MHz
input frequency (20% 80%)
150 250 150 250 150 250 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
9. Measured by forcing V
INPP
(Min) from a 50% duty cycle clock source. All loading with an external R
L
= 50 to V
CC
2 V Input edge rates
100 ps (20% 80%).
10.Duty cycle skew is measured between differential outputs using the deviations of the sum of Tpw and Tpw+ @ 50 MHz.
11. Skew is measured between outputs under identical transitions and conditions. Duty cycle skew is defined only for differential operation when
the delays are measured from the crosspoint of the inputs to the crosspoint of the outputs.
12.Device to device skew is measured between outputs under identical transition @ 50 MHz.
13.Additive RMS jitter with 50% duty cycle clock signal; all inputs and outputs active.
14.V
INPP
(Max) cannot exceed V
CC
V
EE
. Input voltage swing is a singleended measurement operating in differential mode.

NB4L339MNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution 2.7V 622MHZ CLK DIST
Lifecycle:
New from this manufacturer.
Delivery:
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