VO14642AT

Document Number: 81646 For technical questions, contact: optocoupleranswers@vishay.com
www.vishay.com
Rev. 1.5, 26-Apr-11 1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
1 Form A Solid State Relay
VO14642AT, VO14642AABTR
Vishay Semiconductors
DESCRIPTION
The VO14642AT are high speed SPST normally open
(1 form A) solid-state relay in a DIP-6 package. The relays
are constructed as a multi-chip hybrid device. Actuation
control is via an infrared LED. The output switch is a
combination of a photodiode array with MOSFET switches.
The relays can be configured for AC/DC or DC only
operation.
FEATURES
High speed SSR - t
on
/t
off
< 800 μs
•Maximum R
ON
0.25
Isolation test voltage 5300 V
RMS
Load voltage 60 V
Load current 2 A DC configuration
DIP-6 package
Clean bounce free switching
TTL/CMOS compatible input
Available on tape and reel
Pure tin leads
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
Instrumentation
Industrial controls
Security
Notes
IEC 60747-5-2 (VDE 0884) capable, consult sales representative
for details
Agency approvals are valid only for ambient temperature range
- 40 °C to 85 °C
6
S'S
DC
1
5
2
4
3
SS'
20091
AGENCY APPROVALS
UL1577: file no. E52744 system code H, double
protection
cUL - UL1577: file no. E52744 system code H, double
protection
ORDERING INFORMATION
VO14642AxxTR
PART NUMBER
ELECTR.
VARIATION
PACKAGE
CONFIG.
TAPE AND
REEL
PACKAGE UL, cUL
SMD-6, tape and reel VO14642AABTR
DIP-6, Tubes VO14642AT
> 0.1 mm
7.62 mm
DIP
SMD
www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com
Document Number: 81646
2 Rev. 1.5, 26-Apr-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VO14642AT, VO14642AABTR
Vishay Semiconductors
1 Form A Solid State Relay
Notes
(1)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(2)
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
ABSOLUTE MAXIMUM RATING CURVE
Fig. 1 - Load Current (AC/DC) vs. Temperature
ABSOLUTE MAXIMUM RATINGS
(1)
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
INPUT
LED continous forward current I
F
50 mA
LED reverse voltage V
R
5V
LED power dissipation at 25 °C P
diss
80 mW
OUTPUT
DC or peak AC load voltage V
L
60 V
Load current (DC only) I
L
2A
Peak load current (AC/DC) t = 10 ms I
LPK
3.6 A
Output power dissipation at 25 °C P
diss
250 mW
SSR
Total power dissipation P
diss
330 mW
Ambient temperature range T
amb
- 55 to + 85 °C
Storage temperature range T
stg
- 55 to + 125 °C
Soldering temperature
(2)
t 10 s max. T
sld
260 °C
Isolation test voltage for 1 s V
ISO
5300 V
RMS
0
0.2
0.4
0.6
0.8
1.0
1.2
- 40- 55 - 20 0 20 40 60 80 100
I
F
= 5 mA to 15 mA
Temperature (°C)
Load Current (A)
20990-1
Document Number: 81646 For technical questions, contact: optocoupleranswers@vishay.com
www.vishay.com
Rev. 1.5, 26-Apr-11 3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VO14642AT, VO14642AABTR
1 Form A Solid State Relay
Vishay Semiconductors
Note
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal
characteristics of optocouplers application note.
Note
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluations. Typical values are for information only and are not part of the testing requirements.
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Maximum LED junction temperature at 25 °C T
jmax.
125 °C
Maximum output die junction temperature at 25 °C T
jmax.
125 °C
Thermal resistance, junction emitter to board at 25 °C
EB
176 °C/W
Thermal resistance, junction emitter to case at 25 °C
EC
208 °C/W
Thermal resistance, junction detector to board at 25 °C
DB
67 °C/W
Thermal resistance, junction detector to case at 25 °C
DC
134 °C/W
Thermal resistance, junction emitter to junction detector at 25 °C
ED
310 °C/W
Thermal resistance, case to ambient
at 25 °C
CA
2180 °C/W
ELECTRICAL CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
INPUT
LED forward current, switch turn-on I
L
= 1 A, V
L
0.5 V, t = 10 ms I
Fon
0.5 2 mA
LED forward current, switch turn-off V
L
= 60 V, I
L
< 1 μA I
Foff
50 μA
LED reverse current V
R
= 5 V I
R
10 μA
LED forward voltage I
F
= 10 mA V
F
11.31.5V
OUTPUT
On-resistance (AC/DC) I
F
= 10 mA, I
L
= 1 A R
ON
0.18 0.25
On-resistance (DC only) I
F
= 10 mA, I
L
= 2 A R
ON
0.05 0.07
Off-state leakage current I
F
= 0 mA, V
L
= 60 V I
LEAK
A
T
A
θ
CA
T
C
T
JD
T
JE
T
B
θ
EC
θ
EB
θ
DC
θ
DB
θ
BA
θ
DE
T
A
19996
Package

VO14642AT

Mfr. #:
Manufacturer:
Vishay Semiconductors
Description:
Solid State Relays - PCB Mount Normally Open Form 1A 60V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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