PIMN31_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 19 June 2007 3 of 11
NXP Semiconductors
PIMN31
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Per device
P
tot
total power dissipation T
amb
≤ 25 °C
[1]
- 420 mW
T
j
junction temperature - 150 °C
T
amb
ambient temperature −65 +150 °C
T
stg
storage temperature −65 +150 °C
FR4 PCB, standard footprint
Fig 1. Power derating curve
Table 5. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
T
amb
(°C)
−75 17512525 75−25
006aab054
200
300
100
400
500
P
tot
(mW)
0
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 431 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
- - 105 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 298 K/W