LTC4160/LTC4160-1
25
41601fa
APPLICATIONS INFORMATION
Hot Plugging and USB Inrush Current Limiting
The overvoltage protection circuit provides inrush current
limiting due to the long time it takes for OVGATE to fully
enhance the N-channel MOSFET. This prevents the current
from building up in the cable too quickly and dampens
out any resonant overshoot on V
BUS
. It is possible to
observe voltage overshoot on V
BUS
when connecting the
LTC4160/LTC4160-1 to a lab supply if the overvoltage
protection circuit is not used. This overshoot is caused by
the inductance of the long leads from the supply to V
BUS
.
Twisting the wires together from the supply to V
BUS
can
greatly reduce the parasitic inductance of these long leads
and keep V
BUS
at a safe level. USB cables are generally
manufactured with the power leads in close proximity and
thus have fairly low parasitic inductance.
Hot Plugging and USB On-The-Go
If there is more than 4.3V on V
BUS
when On-The-Go is
enabled, the bidirectional switching regulator will not try
to drive V
BUS
. If USB On-The-Go is enabled and an external
supply is then connected to V
BUS
, one of three things will
happen depending on the properties of the external sup-
ply. If the external supply has a regulation voltage higher
than 5.1V, the bidirectional switching regulator will stop
Figure 8. Modified NTC Configuration
+
+
R
NOM
105k
R
NTC
100k
R1
12.7k
NTC
NTCBIAS
0.1V
NTC_ENABLE
41601 F08
LTC4160/LTC4160-1
NTC BLOCK
TOO_COLD
TOO_HOT
0.765 • NTCBIAS
0.349 • NTCBIAS
+
3
4
T
switching and V
BUS
will be held at the regulation voltage
of the external supply. If the external supply has a lower
regulation voltage and is capable of only sourcing current,
then V
BUS
will be regulated to 5.1V. The external supply
will not source current to V
BUS
.
For a supply that can also sink current and has a regulation
voltage less than 5.1V, the bidirectional switching regulator
will source current into the external supply in an attempt
to bring V
BUS
up to 5.1V. As long as the external supply
holds V
BUS
to more than V
OUT
+ 70mV, the bidirectional
switching regulator will source up to 680mA into the sup-
ply. If V
BUS
is held to a voltage that is less than V
OUT
+
70mV then the short circuit timer will shut off the switching
regulator after 7.2ms. The FAULT pin will then go low to
indicate a short circuit current fault.
V
BUS
Bypass Capacitance and USB On-The-Go
Session Request Protocol
When two On-The-Go devices are connected, one will be
the A device and the other will be the B device depending
on whether the device is connected to a micro-A or micro-
B plug. The A device provides power to the B device and
starts as the host. To prolong battery life, the A device
can power down V
BUS
when the BUS is not being used.
If the A device has powered down V
BUS
, the B device can
request the A device to power up V
BUS
and start a new
session using the session request protocol (SRP). The
SRP consists of data-line pulsing and V
BUS
pulsing. The
B device must first pulse the D
+
or D
data lines. The B
device must then pulse V
BUS
only if the A device does not
respond to the data-line pulse. The A device is required
to respond to only one of the pulsing methods. USB A
devices that never power down V
BUS
are not required to
respond to the SRP.
For V
BUS
pulsing, the limit on the V
BUS
capacitance on
the A device allows a B device to differentiate between a
powered down On-The-Go device and a powered down
standard host. The B device will send out a pulse of current
that will raise V
BUS
to a voltage between 2.1 and 5.25V if
connected to an On-The-Go A device which must have no
more than 6.5μF. An On-The-Go A device must drive V
BUS
as soon as the current pulse raises V
BUS
above 2.1V if the
device is capable of responding to V
BUS
pulsing.
LTC4160/LTC4160-1
26
41601fa
APPLICATIONS INFORMATION
This same current pulse must not raise V
BUS
any higher
than 2V when connected to a standard host which must
have at least 96μF. The 96μF for a standard host represents
the minimum capacitance with V
BUS
between 4.75V and
5.25V. Since the SRP pulse must not drive V
BUS
greater
than 2V, the capacitance seen at these voltage levels can be
greater than 96μF, especially if MLCCs are used. Therefore,
the 96μF represents a lower bound on the standard host
bypass capacitance for determining the amplitude and
duration of the current pulse. More capacitance will only
decrease the maximum level that V
BUS
will rise to for a
given current pulse.
Figure 9 shows an On-The-Go device using the LTC4160/
LTC4160-1 acting as the A device. Additional capacitance
can be placed on the V
BUS
pin of the LTC4160/LTC4160-
1 when using the overvoltage protection circuit. The B
device may not be able to distinguish between a powered
down LTC4160/LTC4160-1 with overvoltage protection
and a powered down standard host because of this extra
capacitance. In addition, if the SRP pulse raises V
BUS
above its UVLO threshold of 4.3V the LTC4160/LTC4160-1
will assume input power is available and will not attempt
to drive V
BUS
. Therefore, it is recommended that an On-
The-Go device using the LTC4160/LTC4160-1 respond to
data-line pulsing.
When an On-The-Go device using the LTC4160/LTC4160-1
becomes the B device, as in Figure 10, it must send out
a data line pulse followed by a V
BUS
pulse to request a
session from the A device. The On-The-Go device designer
can choose how much capacitance will be placed on the
V
BUS
pin of the LTC4160/LTC4160-1 and then generate
a V
BUS
pulse that can distinguish between a powered
down On-The-Go A device and a powered down standard
host. A suitable pulse can be generated because of the
disparity in the bypass capacitances of an On-The-Go A
device and a standard host even if there is somewhat more
than 6.5μF capacitance connected to the V
BUS
pin of the
LTC4160/LTC4160-1.
Board Layout Considerations
The Exposed Pad on the backside of the LTC4160/
LTC4160-1 package must be securely soldered to the PC
board ground. This is the primary ground pin in the pack-
age, and it serves as the return path for both the control
circuitry and N-channel MOSFET switch.
Furthermore, due to its high frequency switching circuitry,
it is imperative that the input capacitor, inductor, and output
capacitor be as close to the LTC4160/LTC4160-1 as pos-
sible and that there be an unbroken ground plane under the
LTC4160/LTC4160-1 and all of its external high frequency
components. High frequency current, such as the V
BUS
current tends to find its way on the ground plane along a
mirror path directly beneath the incident path on the top
of the board. If there are slits or cuts in the ground plane
due to other traces on that layer, the current will be forced
to go around the slits. If high frequency currents are not
allowed to flow back through their natural least-area path,
excessive voltage will build up and radiated emissions will
occur (see Figure 11). There should be a group of vias
directly under the grounded backside leading directly
down to an internal ground plane. To minimize parasitic
inductance, the ground plane should be as close as pos-
sible to the top plane of the PC board (layer 2).
Figure 9. LTC4160/LTC4160-1 as the A Device
ON-THE-GO
POWER
MANAGER
ON-THE-GO
TRANSCEIVER
B DEVICE
41601 F11
A DEVICE
D
+
D
OVSENS
OVGATE
V
BUS
C
B
<6.5µF
C
A
<6.5µF
WITHOUT OVP
OVP
(OPTIONAL)
ON-THE-GO
TRANSCEIVER
LTC4160/
LTC4160-1
ENOTG
LTC4160/LTC4160-1
27
41601fa
APPLICATIONS INFORMATION
Figure 10. LTC4160/LTC4160-1 as the B Device
Figure 11. Higher Frequency Ground Current Follow Their
Incident Path. Slices in the Ground Plane Create Large Loop
Areas. The Large Loop Areas Increase the Inductance of the Path
Leading to Higher System Noise.
The IDGATE pin for the external ideal diode controller has
extremely limited drive current. Care must be taken to
minimize leakage to adjacent PC board traces. 100nA of
leakage from this pin will introduce an additional offset to
the ideal diode of approximately 10mV. To minimize leakage,
the trace can be guarded on the PC board by surrounding
it with V
OUT
connected metal, which should generally be
less than one volt higher than IDGATE.
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC4160/LTC4160-1:
1. The Exposed Pad of the package (Pin 21) should connect
directly to a large ground plane to minimize thermal and
electrical impedance.
2. The trace connecting V
BUS
to its respective decoupling
capacitor should be as short as possible. The GND
side of these capacitors should connect directly to the
ground plane of the part. These capacitors provide the
AC current to the internal power MOSFETs and their
drivers. It is critical to minimize inductance from these
capacitors to the LTC4160/LTC4160-1.
3. Connections between the PowerPath switching regulator
inductor and the output capacitor on V
OUT
should be kept
as short as possible. Use area fills whenever possible.
The GND side of the output capacitors should connect
directly to the thermal ground plane of the part.
4. The switching power trace connecting SW to its respec-
tive inductor should be minimized to reduce radiated
EMI and parasitic coupling.
STANDARD
USB HOST OR
ON-THE-GO
POWER
MANAGER
STANDARD OR
ON-THE-GO
TRANSCEIVER
A DEVICE
41601 F12
B DEVICE
D
+
D
OVSENS
OVGATE
V
BUS
C
A
<6.5µF FOR OTG DEVICES
>96µF FOR STANDARD HOST
C
B
<6.5µF
WITHOUT OVP
OVP
(OPTIONAL)
ON-THE-GO
TRANSCEIVER
LTC4160/
LTC4160-1
ENOTG
41601 F11

LTC4160EUDC#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Battery Management Switching Power Manager with USB On-the-Go and Overvoltage Protection
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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