09/15 Rev
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Recommended Reflow Soldering Profile
≦5 SEC.
100SEC.MAX.
255-260 °C
217 °C
200 °C
150 °C
60-120SEC.
TEMPERATURE
SMT Soldering Profile
Pb free reflow soldering Profile
3 °C/SEC.MAX.
3 °C/SEC.MAX.
6 °C/SEC.MAX.
SMT Reflow Soldering Instructions
6
In factory original sealed bag package
TEMPERATURE CONDITION HUMIDITY CONDITION
5°C ~ 30°C Below 60%RH
After opened and not in factory original sealed bag package
TEMPERATURE CONDITION HUMIDITY CONDITION
5°C ~ 30°C Below 60%RH
STORAGE TIME
Within 4 weeks (MSL as level 2a)
Storage Condition
Customer must finish rework within 3 sec. under 350˚C / 662˚F.
The head of soldering iron cannot touch copper foil.
Soldering Iron
Rework
Basic spec is
≦
4 sec when 260˚C / 500˚F. If temperature is higher, time should
be shorter (+10˚C / 50˚F
→
1 sec). Power dissipation of Iron should be smaller
than 15W, and temperature should be controllable. Surface temperature
of the device should be under 230˚C /446˚F.
We recommend the reflow temperature 245˚C / 473˚F (+/- 5˚C / 41˚F).
The maximum soldering temperature should be limited to 260˚C / 500˚F .
Number of reflow process shall be 2 time or less.
TIME
