BFU520Y All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 20 February 2014 3 of 20
NXP Semiconductors
BFU520Y
Dual NPN wideband silicon RF transistor
5. Design support
6. Limiting values
7. Recommended operating conditions
[1] T
sp
is the temperature at the solder point of the collector lead.
Table 5. Available design support
Download from the BFU520Y product information page on http://www.nxp.com.
Support item Available Remarks
Device models for Agilent EEsof EDA ADS yes Based on Mextram device model.
SPICE model yes Based on Gummel-Poon device
model.
S-parameters yes
Noise parameters yes
Solder pattern yes
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CB
collector-base voltage open emitter - 30 V
V
CE
collector-emitter voltage open base - 16 V
shorted base - 30 V
V
EB
emitter-base voltage open collector - 3 V
I
C
collector current -50mA
T
stg
storage temperature 65 +150 C
V
ESD
electrostatic discharge voltage Human Body Model (HBM) According to JEDEC
standard 22-A114E
- 150 V
Charged Device Model (CDM) According to
JEDEC standard 22-C101B
- 2kV
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
CB
collector-base voltage open emitter - - 24 V
V
CE
collector-emitter voltage open base - - 12 V
shorted base - - 24 V
V
EB
emitter-base voltage open collector - - 2 V
I
C
collector current - - 30 mA
P
i
input power Z
S
= 50 --10dBm
T
j
junction temperature 40 - +150 C
P
tot
total power dissipation T
sp
87 C
[1]
--450mW