MCP16301 600 mA DEMO BOARD
USER’S GUIDE
2011 Microchip Technology Inc. DS51978A-page 17
Appendix B. Bill of Materials
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
4 BUMP BUMPON Square 0.40” x 0.1” Black 3M™ SJ-5007 (Black)
2 C1, C2 CAP 4.7uF 50V CERAMIC X7R 1210 10% Taiyo Yuden
®
UMK325B7475KM-T
2 C3, C4 CAP 10uF 6.3V CERAMIC X7R 0805 10% Taiyo Yuden JMK212B7106KG-T
1 C5 CAP 0.1uF 16V CERAMIC X7R 0603 10% AVX Corporation 0603YC104KAT2A
1 D1 DIODE SCHOTTKY 40V 1A SMA Diodes Incorporated
®
B140-13-F
1 D2 DIODE SWITCH 75V 200 mW SOD-323 Diodes Incorporated 1N4448WS-7-F
1 L1 MSS6132 15 µH Shielded Power Inductor Coilcraft
®
MSS6132-153ML
1 PCB MCP16301 4V to 30V V
IN
, 3.3V 600 mA I
OUT
Printed Circuit Board
Microchip Technology Inc. 104-00352
1 R1 RES 1.00M OHM 1/8W 1% 0805 SMD Panasonic
®
ECG ERJ-6ENF1004V
1 R2 RES 10 OHM 1/8W 1% 0805 SMD Panasonic ECG ERJ-6ENF10R0V
1 R3 RES 31.6K OHM 1/8W 1% 0805 SMD Panasonic ECG ERJ-6ENF3162V
1 R4 RES 10.0K OHM 1/8W 1% 0805 SMD Panasonic ECG ERJ-6ENF1002V
1 U1 MCP16301 High Input Voltage Buck
Converter SOT23
Microchip Technology Inc. MCP16301
4 VIN,
VOUT,
GND,
GND
PC TEST POINT TIN SMD Harwin S1751-46R
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
