10
LTC2602/LTC2612/LTC2622
2602fa
OPERATIO
U
Serial Interface
The CS/LD input is level triggered. When this input is taken
low, it acts as a chip-select signal, activating the SDI and
SCK buffers and enabling the input shift register. Data
(SDI input) is transferred at the next 24 rising SCK edges.
The 4-bit command, C3-C0, is loaded first; then the 4-bit
DAC address, A3-A0; and finally the 16-bit data word. The
data word comprises the 16-, 14- or 12-bit input code,
ordered MSB-to-LSB, followed by 0, 2 or 4 don’t-care bits
(LTC2602, LTC2612 and LTC2622 respectively). Data can
only be transferred to the device when the CS/LD signal is
low.The rising edge of CS/LD ends the data transfer and
causes the device to carry out the action specified in the
24-bit input word. The complete sequence is shown in
Figure 2a.
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 1. The first four commands in the table
consist of write and update operations. A write operation
loads a 16-bit data word from the 32-bit shift register into
the input register of the selected DAC, n. An update
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DAC if it had been in power-down mode. The data path and
registers are shown in the block diagram.
While the minimum input word is 24 bits, it may optionally
be extended to 32 bits to accommodate microprocessors
which have a minimum word width of 16 bits (2 bytes). To
use the 32-bit word width, 8 don’t-care bits are transferred
to the device first, followed by the 24-bit word as just
described. Figure 2b shows the 32-bit sequence.
Power-Down Mode
For power-constrained applications, power-down mode
can be used to reduce the supply current whenever less
than two outputs are needed. When in power-down, the
buffer amplifiers, bias circuits and reference inputs are
disabled, and draw essentially zero current. The DAC
outputs are put into a high-impedance state, and the
Power-On Reset
The LTC2602/LTC2612/LTC2622 clear the outputs to zero
scale when power is first applied, making system initializa-
tion consistent and repeatable.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero
outputs from the DAC during this time. The LTC2602/
LTC2612/LTC2622 contain circuitry to reduce the power-
on glitch; furthermore, the glitch amplitude can be made
smaller by reducing the ramp rate of the power supply. For
example, if the power supply is ramped to 5V in 1ms, the
analog outputs rise less than 10mV above ground (typ)
during power-on. See Power-On Reset Glitch in the Typi-
cal Performance Characteristics section.
Power Supply Sequencing
The voltage at REF (Pin 4) should be kept within the range
0.3V V
REF
V
CC
+ 0.3V (see Absolute Maximum
Ratings). Particular care should be taken to observe these
limits during power supply turn-on and turn-off sequences,
when the voltage at V
CC
(Pin 6) is in transition.
Transfer Function
The digital-to-analog transfer function is
V
k
V
OUT IDEAL
N
REF()
=
2
where k is the decimal equivalent of the binary DAC input
code, N is the resolution and V
REF
is the voltage at REF
(Pin 4).
Table 1.
COMMAND*
C3 C2 C1 C0
0000 Write to Input Register n
0001 Update (Power Up) DAC Register n
0010 Write to Input Register n, Update (Power Up) All n
0011 Write to and Update (Power Up) n
0100 Power Down n
1111 No Operation
ADDRESS (n)*
A3 A2 A1 A0
0000 DAC A
0001 DAC B
1111 All DACs
*Command and address codes not shown are reserved and should not be used.
11
LTC2602/LTC2612/LTC2622
2602fa
C3
COMMAND ADDRESS DATA (16 BITS)
C2
C1
C0
A3
A2
A1
A0
D13D14D15
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0
2602 TBL01
MSB
LSB
C3
COMMAND ADDRESS DATA (14 BITS + 2 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D13
D12
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X X
2602 TBL02
MSB
LSB
C3
COMMAND ADDRESS DATA (12 BITS + 4 DON’T-CARE BITS)
C2
C1
C0
A3
A2
A1
A0
D11 D10 D9 D8
D7
D6
D5 D4 D3 D2 D1
D0 X XXX
2602 TBL03
MSB
LSB
INPUT WORD (LTC2602)
INPUT WORD (LTC2612)
INPUT WORD (LTC2622)
OPERATIO
U
output pins are passively pulled to ground through indi-
vidual 90k resistors. Input- and DAC-register contents
are not disturbed during power-down.
Either channel or both channels can be put into power-
down mode by using command 0100
b
in combination with
the appropriate DAC address, (n). The 16-bit data word is
ignored. The supply and reference currents are reduced by
approximately 50% for each DAC powered down; the
effective resistance at REF (pin 4) rises accordingly,
becoming a high-impedance input (typically > 1G) when
both DACs are powered down.
Normal operation can be resumed by executing any com-
mand which includes a DAC update, as shown in Table 1.
The selected DAC is powered up as its voltage output is
updated. When a DAC which is in a powered-down state is
powered up and updated, normal settling is delayed. If one
of the two DACs is in a powered-down state prior to the
update command, the power-up delay is 5µs. If, on the
other hand, both DACs are powered down, then the main
bias generation circuit block has been automatically shut
down in addition to the individual DAC amplifiers and
reference inputs. In this case, the power up delay time is
12µs (for V
CC
= 5V) or 30µs (for V
CC
= 3V).
Voltage Outputs
Each of the two rail-to-rail amplifiers contained in these
parts has guaranteed load regulation when sourcing or
sinking up to 15mA at 5V (7.5mA at 3V).
Load regulation is a measure of the amplifier’s ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is ex-
pressed in LSB/mA.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifiers’ DC output
impedance is 0.050 when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by the
25 typical channel resistance of the output devices; e.g.,
when sinking 1mA, the minimum output voltage = 25
1mA = 25mV. See the graph Headroom at Rails vs Output
Current in the Typical Performance Characteristics sec-
tion.
The amplifiers are stable driving capacitive loads of up to
1000pF.
12
LTC2602/LTC2612/LTC2622
2602fa
OPERATIO
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Board Layout
The excellent load regulation and DC crosstalk perfor-
mance of these devices is achieved in part by keeping
“signal” and “power” grounds separated internally and by
reducing shared internal resistance.
The GND pin functions both as the node to which the
reference and output voltages are referred and as a return
path for power currents in the device. Because of this,
careful thought should be given to the grounding scheme
and board layout in order to ensure rated performance.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continu-
ous and uninterrupted plane, except for necessary lead
pads and vias, with signal traces on another layer.
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.050), and will degrade DC crosstalk.
Note that the LTC2602/LTC2612/LTC2622 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is
limited to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown in
Figure 3b. Similarly, limiting can occur near full scale
when the REF pin is tied to V
CC
. If V
REF
= V
CC
and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at V
CC
as shown in Figure 3c. No full-scale
limiting can occur if V
REF
is less than V
CC
– FSE.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.

LTC2602IMS8#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC 2x 16-B R2R DACs in 8-Lead MS
Lifecycle:
New from this manufacturer.
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