TLHE4600
www.vishay.com
Vishay Semiconductors
Rev. 1.9, 14-Oct-14
1
Document Number: 83130
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Intensity LED in Ø 3 mm Tinted Diffused Package
DESCRIPTION
This device has been designed to meet the increasing
demand for AlInGaP technology general indicating and
lighting purposes.
It is housed in a 3 mm diffused plastic package. The wide
viewing angle of these devices provides a high brightness.
All packing units are categorized in luminous intensity and
color groups. That allows users to assemble LEDs with
uniform appearance.developed for standard applications
like general indicating and lighting purposes.
FEATURES
• AlInGaP technology
• Standard Ø 3 mm (T-1) package
• Small mechanical tolerances
• Suitable for DC and high peak current
• Wide viewing angle
• Very high intensity
• Luminous intensity color categorized
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Status lights
•Off / on indicator
• Background illumination
• Readout lights
• Maintenance lights
•Legend light
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: 3 mm
• Product series: standard
• Angle of half intensity: ± 60°
PARTS TABLE
PART COLOR
LUMINOUS INTENSITY
(mcd)
at I
F
(mA)
WAVELENGTH
(nm)
at I
F
(mA)
FORWARD VOLTAGE
(V)
at I
F
(mA)
TECHNOLOGY
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
TLHE4600 Yellow 10 26 - 10 581 588 594 10 - 1.9 2.6 20 AllnGaP on GaAs
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
TLHE4600
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
5V
DC forward current T
amb
≤ 60 °C I
F
30 mA
Surge forward current t
p
≤ 10 μs I
FSM
0.1 A
Power dissipation T
amb
≤ 60 °C P
V
80 mW
Junction temperature T
j
100 °C
Operating temperature range T
amb
-40 to +100 °C
Storage temperature range T
stg
-55 to +100 °C
Soldering temperature t ≤ 5 s, 2 mm from body T
sd
260 °C
Thermal resistance junction/ambient R
thJA
400 K/W