NCP1093, NCP1094
www.onsemi.com
12
PACKAGE DIMENSIONS
DFN10, 3x3, 0.5P
CASE 485C
ISSUE E
10X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
15
10 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG
SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. FOR DEVICE OPN CONTAINING W OPTION, DETAIL A AND B
ALTERNATE CONSTRUCTION ARE NOT APPLICABLE. WET-
TABLE FLANK CONSTRUCTION IS DETAIL B AS SHOWN ON
SIDE VIEW OF PACKAGE.
B
A
0.15
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN ONE
REFERENCE
0.10 C
0.08 C
(A3)
C
10X
10X
0.10 C
0.05 C
A B
NOTE 3
K
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 2.40 2.60
E 3.00 BSC
E2 1.70 1.90
e 0.50 BSC
L 0.35 0.45
L1 0.00 0.03
DETAIL A
K 0.19 TYP
2X
2X
DETAIL B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
2.64
1.90
0.50
0.55
10X
3.30
0.30
10X
DIMENSIONS: MILLIMETERS
PITCH
PACKAGE
OUTLINE
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
ALTERNATE B−2ALTERNATE B−1
ALTERNATE A−2ALTERNATE A−1
DETAIL B
WETTABLE FLANK OPTION
CONSTRUCTION
A1
A3
NCP1093/D
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