(1.00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
MEC1–120–02–L–D–RA1–SL
MEC1–130–02–L–D –EM2
MEC1–120–02–F–D–EM2
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
(No. of Positions + 2) x
(1.00) .03937 + (2.54) .100
(No. of Positions + 2)
x (1.00) .03937
(0.36) .014
(1.00)
.03937
(8.89)
.350
(0.91)
.036
(0.91)
.036
(11.68)
.460
(11.96)
.471
(1.78)
.070
DIA
(1.52)
.060
01
02
(8.13)
.320
(2.51)
.099
(6.81)
.268
MEC1
POSITIONS
PER ROW
PLATING
OPTION
D
1
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.84 mm) .230" to (8.13 mm) .320"
RoHS Compliant: Ye s
05, 08, 20, 30,
40, 50, 60, 70
–F
= Gold flash
on contact,
Matte Tin
on tail
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
CARD
SLOT
–02
= (1.60 mm)
.062"
thick card
F-217
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SL
Mates with:
(1.60 mm)
.062" card
Mates with:
(1.60 mm)
.062" card
• Elevated body
height
• Other platings
Contact Samtec.
RA1 NP
MEC1
POSITIONS
PER ROW
PLATING
OPTION
D
1
05, 08, 20, 30,
40, 50, 60, 70
02
EM2 NP
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
1.8 A per pin
(2 adjacent pins powered)
Operating
Temp Range:
-55 °C to +125 °C
Insertion Depth:
(5.84 mm) .230" to
(8.13 mm) .320"
RoHS Compliant:
Ye s
Lead–Free Solderable:
Ye s
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
RIGHT-ANGLE/EDGE MOUNT SOCKETS
Note: While optimized for 50 W
applications, this connector with
alternative signal/ground patterns
may also perform well in certain
75 W applications. Contact
Samtec for further information.
–NP
= No Polarization
(8 positions only)
Leave Blank for
polarization
–NP
= No Polarization
(8 positions only)
Leave Blank for
polarization
POSITIONS
PER ROW
POLARIZED
POSITIONS
05
3, 4
08
5, 6
20
15, 16
30
21, 22
40
31, 32
50
41, 42
60
31, 32, 63 & 64
70
53, 54, 115 & 116
POSITIONS
PER ROW
POLARIZED
POSITIONS
05
3, 4
08
5, 6
20
15, 16
30
21, 22
40
31, 32
50
41, 42
60
31, 32, 63
& 64
70
53, 54, 115
& 116
ALSO
AVAILABLE
(MOQ Required)
(No. of Positions + 2) x
(1.00) .03937 + (12.45) .490
02
(1.19)
.047
(0.38)
.015
(No. of Positions + 2)
x (1.00) .03937
(0.36)
.014
(8.89)
.350
(1.00)
.03937
(4.57)
.180
(3.15)
.124
.268
±
01
(4.70)
.185
(8.13)
.320
(5.21)
.205
• Edge mount leads
for (0.80 mm) .031"
thick board
• Other platings
Contact Samtec.
ALSO
AVAILABLE
(MOQ Required)
For complete scope of
recognitions see
www.samtec.com/quality
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
RECOGNITIONS
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
Note: While optimized for 50 W applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75 W applications. Contact Samtec for
further information.
SPECIFICATIONS
PROCESSING
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (05-40)
(0.15 mm) .006" max (50-70)
–F
= Gold flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
Gbps
HIGH-SPEED CHANNEL PERFORMANCE
MEC1-RA
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
