CUS06
2013-11-01
2
Electrical Characteristics
(Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
V
FM (1)
I
FM
= 0.1 A ⎯ 0.35 ⎯
V
FM (2)
I
FM
= 0.7 A ⎯ 0.42 0.45
Peak forward voltage
V
FM (3)
I
FM
= 1.0 A ⎯ 0.47 ⎯
V
I
RRM (1)
V
RRM
= 5 V ⎯ 0.7 ⎯ μA
Repetitive peak reverse current
I
RRM (2)
V
RRM
= 20 V ⎯ 3.0 30 μA
Junction capacitance C
j
V
R
= 10 V, f = 1.0 MHz ⎯ 40 ⎯ pF
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
⎯ ⎯ 75
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
⎯ ⎯ 150
°C/W
Thermal resistance (junction to lead) R
th (j-ℓ)
Junction to lead of cathode side ⎯ ⎯ 30 °C/W
Marking
Abbreviation Code Part No.
6 CUS06
Standard Soldering Pad
Handling Precaution
Schottky barrier diodes have reverse current characteristic compared to the other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
This device is V
F
-I
RRM
trade-off type, lower V
F
higher I
RRM
; therefore, thermal runaway might occur when
voltage is applied. Please take forward and reverse loss into consideration during the design.
The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant.
The following are the general derating methods that we recommend for designing a circuit using this device.
V
RRM
: Use this rating with reference to the above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
I
F(AV)
: We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of I
F(AV)
and T
j
be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-I
F(AV)
curve.
I
FSM
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
T
j
: Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at T
j
of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifiers databook for further information.
Unit: mm
2.0
1.1
0.5
0.8
0.8
