13
LT1107
1107fa
U
PACKAGE
D
E
SC
R
I
PTI
O
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
J8 1298
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.125
3.175
MIN
0.100
(2.54)
BSC
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.005
(0.127)
MIN
0.405
(10.287)
MAX
0.220 – 0.310
(5.588 – 7.874)
12
3
4
87
65
0.025
(0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
OBSOLETE PACKAGE
14
LT1107
1107fa
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
U
PACKAGE
D
E
SC
R
I
PTI
O
N8 0502
.100
(2.54)
BSC
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.125
(3.175)
MIN
12
3
4
876
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.009 – .015
(0.229 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
15
LT1107
1107fa
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
U
PACKAGE
D
E
SC
R
I
PTI
O
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
.008 – .010
(0.203 – 0.254)
SO8 0502
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
N
2
3
4
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
N
1 2 3 N/2
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

LT1107CN8

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
IC REG BUCK BST ADJ 1.5A 8DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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