NSD16F3T5G

© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 1
1 Publication Order Number:
NSD16F3/D
NSD16F3T5G
Switching Diode
The NSD16F3T5G device is a spin−off of our popular SOT−23
three−leaded device. It is designed for switching applications and is
housed in the SOT−1123 surface mount package. This device is ideal
for low−power surface mount applications where board space is at a
premium.
Features
Reduces Board Space
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage V
R
75 Vdc
Forward Current I
F
200 mAdc
Peak Forward Surge Current I
FM(surge)
500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation, T
A
= 25°C
Derate above 25°C
P
D
(Note 1)
290
2.3
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
(Note 1)
432 °C/W
Total Device Dissipation, T
A
= 25°C
Derate above 25°C
P
D
(Note 2)
347
2.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
(Note 2)
360 °C/W
Thermal Resistance,
Junction−to−Lead 3
R
Y
JL
(Note 2)
143 °C/W
Junction and Storage Temperature Range T
J
, T
stg
55 to
+150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. 100 mm
2
1 oz, copper traces.
2. 500 mm
2
1 oz, copper traces.
SOT−1123
CASE 524AA
STYLE 2
1
NSD16F3T5G
ORDERING INFORMATION
http://onsemi.com
MARKING DIAGRAM
Device Package Shipping
NSD16F3T5G SOT−1123
(Pb−Free)
8000/Tape & Ree
l
T = Device Code
M = Date Code
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
2
3
1
T M
1
ANODE
3
CATHODE
NSD16F3T5G
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2
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(V
R
= 100 Vdc)
(V
R
= 75 Vdc, T
J
= 150°C)
(V
R
= 25 Vdc, T
J
= 150°C)
I
R
1.0
50
30
mAdc
Reverse Breakdown Voltage
(I
BR
= 100 mAdc)
V
(BR)
75 Vdc
Forward Voltage
(I
F
= 1.0 mAdc)
(I
F
= 10 mAdc)
(I
F
= 50 mAdc)
(I
F
= 150 mAdc)
V
F
715
855
1000
1250
mV
Diode Capacitance
(V
R
= 0, f = 1.0 MHz)
C
D
2.0 pF
Forward Recovery Voltage
(I
F
= 10 mAdc, t
r
= 20 ns)
V
FR
1.75 Vdc
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc, R
L
= 50 W)
t
rr
6.0 ns
Stored Charge
(I
F
= 10 mAdc to V
R
= 5.0 Vdc, R
L
= 500 W)
Q
S
45 pC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes: 2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes: 3. t
p
» t
rr
+10 V
2.0 k
820 W
0.1 mF
D.U.T.
V
R
100 mH
0.1 mF
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
t
r
t
p
t
10%
90%
I
F
I
R
t
rr
t
i
R(REC)
= 1.0 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
I
F
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
NSD16F3T5G
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3
TYPICAL CHARACTERISTICS
0.1
V
F
, FORWARD VOLTAGE (V)
0.01
10
0
V
R
, REVERSE VOLTAGE (V)
1.0
0.1
0.01
0.001
10 20 30 40
50
0.62
0
V
R
, REVERSE VOLTAGE (V)
0.60
0.56
0.50
0.48
C
D
, DIODE CAPACITANCE (pF)
246 8
I
F
, FORWARD CURRENT (mA)
Figure 2. V
F
vs. I
F
Figure 3. I
R
vs. V
R
Figure 4. Capacitance
I
R
, REVERSE CURRENT (μA)
0.1
1.0
10
100
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
85°C
55°C
150°C
125°C
25°C
-40°C
-55°C
60 70
-40°C
150°C
125°C
85°C
55°C
25°C
0.52
0.54
0.58
1357
85°C
Cap

NSD16F3T5G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Diodes - General Purpose, Power, Switching SS SWITCHING DIODE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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