© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 1
1 Publication Order Number:
NSD16F3/D
NSD16F3T5G
Switching Diode
The NSD16F3T5G device is a spin−off of our popular SOT−23
three−leaded device. It is designed for switching applications and is
housed in the SOT−1123 surface mount package. This device is ideal
for low−power surface mount applications where board space is at a
premium.
Features
• Reduces Board Space
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage V
R
75 Vdc
Forward Current I
F
200 mAdc
Peak Forward Surge Current I
FM(surge)
500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation, T
A
= 25°C
Derate above 25°C
P
D
(Note 1)
290
2.3
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
(Note 1)
432 °C/W
Total Device Dissipation, T
A
= 25°C
Derate above 25°C
P
D
(Note 2)
347
2.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
(Note 2)
360 °C/W
Thermal Resistance,
Junction−to−Lead 3
R
Y
JL
(Note 2)
143 °C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to
+150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. 100 mm
2
1 oz, copper traces.
2. 500 mm
2
1 oz, copper traces.
SOT−1123
CASE 524AA
STYLE 2
1
NSD16F3T5G
ORDERING INFORMATION
http://onsemi.com
MARKING DIAGRAM
Device Package Shipping
†
NSD16F3T5G SOT−1123
(Pb−Free)
8000/Tape & Ree
T = Device Code
M = Date Code
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2
3
1
T M
1
ANODE
3
CATHODE