6.42
4
IDT71V2557, IDT71V2559, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Flow-Through Outputs Commercial and Industrial Temperature Ranges
Functional Block Diagram  256K x 18
Recommended DC Operating
Conditions
NOTES:
1. VIL (min.) = –1.0V for pulse width less than tCYC/2, once per cycle.
2. VIH (max.) = +6.0V for pulse width less than tCYC/2, once per cycle.
Clk
DQ
DQ
DQ
Address A [0:17]
Control Logic
Address
Control
DI DO
Input R
egister
4878 drw 01a
Clock
Data I/O [0:15], I/O P[1:2]
Mux
Sel
Gate
OE
CE
1
,CE
2
CE
2
R/
W
CEN
ADV/
LD
BW
x
LBO
256K x 18 BIT
MEMORY ARRAY
,
Parameter
Min.
Typ.
Max.
Unit
V
DD
Core Supply Voltage
3.135
3.3
3.465
V
V
DDQ
I/O Supply Voltage
2.375
2.5
2.625
V
V
SS
Ground
0
0
0
V
V
IH
Input High Voltage - Inputs
1.7
____
V
DD
+0.3
V
V
IH
Input High Voltage - I/O
1.7
____
V
DDQ
+0.3
(2)
V
V
IL
Input Low Voltage
-0.3
(1)
____
0.7
V
4878 tbl 03
6.42
IDT71V2557, IDT71V2559, 128K x 36, 256K x 18, 3.3V SynchronousSRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Flow-Through Outputs Commercial and Industrial Temperature Ranges
5
Recommended Operating
Temperature and Supply Voltage
Pin Configuration  128K x 36
NOTES:
1. Pins 14, 64, and 66 do not have to be connected directly to VSS as long as the input voltage is < VIL.
2. Pin 16 does not have to be connected directly to VDD as long as the input voltage is > VIH.
3. Pins 83 and 84 are reserved for future 8M and 16M respectively.
4. DNU = Do not use; Pins 38, 39, 42 and 43 are reserved for respective JTAG pins: TMS, TDI, TDO and TCK on future
revisions. Within this current version, these pins are not connected.
5. On future revisions, Pin 64 will be used for ZZ (sleep mode).
Top View
100 TQFP
10099989796959493929190 8786858483828189 88
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
A
6
A
7
C
E
1
C
E
2
B
W
4
B
W
3
B
W
2
B
W
1
C
E
2
V
D
D
V
S
S
C
LK
R
/
W
C
E
N
O
E
A
D
V
/
LD
N
C
(3)
N
C
(3)
A
8
A
9
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
D
N
U
(4)
D
N
U
(4)
D
N
U
(4)
D
N
U
(4)
LB
O
A
14
A
13
A
12
A
11
A
10
V
D
D
V
S
S
A
0
A
1
A
2
A
3
A
4
A
5
I/O
31
I/O
30
V
DDQ
V
SS
I/O
29
I/O
28
I/O
27
I/O
26
V
SS
V
DDQ
I/O
25
I/O
24
V
SS
V
DD
I/O
23
I/O
22
V
DDQ
V
SS
I/O
21
I/O
20
I/O
19
I/O
18
V
SS
V
DDQ
I/O
17
I/O
16
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
I/O
14
V
DDQ
V
SS
I/O
13
I/O
12
I/O
11
I/O
10
V
SS
V
DDQ
I/O
9
I/O
8
V
SS
V
DD
I/O
7
I/O
6
V
DDQ
V
SS
I/O
5
I/O
4
I/O
3
I/O
2
V
SS
V
DDQ
I/O
1
I/O
0
4878 drw 02
V
SS
(1)
I/O
15
I/O
P3
V
DD
(2)
I/O
P4
A
15
A
16
I/O
P1
V
SS
(1)
I/O
P2
V
SS
(1,5)
,
Grade Temperature
(1)
V
SS
V
DD
V
DDQ
Commercial C to +70°C 0V 3.3V±5% 2.5V±5%
Industrial -40°C to +85°C 0V 3.3V±5% 2.5V±5%
4878 tbl 05
NOTE:
1. TA is the "instant on" case temperature.
6.42
6
IDT71V2557, IDT71V2559, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Flow-Through Outputs Commercial and Industrial Temperature Ranges
Absolute Maximum Ratings
(1)
100 TQFP Capacitance
(1)
(TA = +25°C, f = 1.0MHz)
Pin Configuration  256K x 18
NOTES:
1. Pins 14, 64, and 66 do not have to be connected directly to VSS as long as the input
voltage is < VIL.
2. Pin 16 does not have to be connected directly to VDD as long as the input voltage is
> VIH.
3. Pins 83 and 84 are reserved for future 8M and 16M respectively.
4. DNU = Do not use; Pins 38, 39, 42 and 43 are reserved for respective
JTAG pins: TMS, TDI, TDO and TCK on future revisions. Within this current
version, these pins are not connected.
5. On future revisions, pin 64 will be used for ZZ (sleep mode).
Top View
100 TQFP
NOTE:
1. This parameter is guaranteed by device characterization, but not production tested.
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. VDD terminals only.
3. VDDQ terminals only.
4. Input terminals only.
5. I/O terminals only.
6. This is a steady-state DC parameter that applies after the power supply has
reached its nominal operating value. Power sequencing is not necessary;
however, the voltage on any input or I/O pin cannot exceed VDDQ during power
supply ramp up.
7. TA is the "instant on" case temperature.
10099989796959493929190 8786858483828189 88
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
A
6
A
7
C
E
1
C
E
2
N
C
N
C
B
W
2
B
W
1
C
E
2
V
D
D
V
S
S
C
LK
R
/
W
C
E
N
O
E
A
D
V
/
LD
N
C
(3)
N
C
(3)
A
8
A
9
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
D
N
U
(4)
D
N
U
(4)
D
N
U
(4)
D
N
U
(4)
LB
O
A
15
A
14
A
13
A
12
A
11
V
D
D
V
S
S
A
0
A
1
A
2
A
3
A
4
A
5
NC
NC
V
DDQ
V
SS
NC
I/O
P2
I/O
15
I/O
14
V
SS
V
DDQ
I/O
13
I/O
12
V
SS
V
DD
I/O
11
I/O
10
V
DDQ
V
SS
I/O
9
I/O
8
NC
NC
V
SS
V
DDQ
NC
NC
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
V
DDQ
V
SS
NC
I/O
P1
I/O
7
I/O
6
V
SS
V
DDQ
I/O
5
I/O
4
V
SS
V
DD
I/O
3
I/O
2
V
DDQ
V
SS
I/O
1
I/O
0
NC
NC
V
SS
V
DDQ
NC
NC
4878 drw 02a
V
SS
(1)
NC
NC
V
DD
(2)
NC
A
16
A
17
NC
V
SS
(1)
A
10
V
SS
(1,5)
,
Symbol
Rating
Commercial &
Industrial Value
Unit
V
TE RM
(2)
Terminal Voltage with
Respect to GND
-0.5 to +4.6 V
V
TE RM
(3,6)
Terminal Voltage with
Respect to GND
-0.5 to V
DD
V
V
TE RM
(4,6)
Terminal Voltage with
Respect to GND
-0.5 to V
DD
+0.5 V
V
TE RM
(5,6)
Terminal Voltage with
Respect to GND
-0.5 to V
DDQ
+0.5 V
T
A
(7)
Commercial
Operating Temperature
-0 to +70
o
C
Industrial
Operating Temperature
-40 to +85
o
C
T
BIAS
Temperature Under Bias -55 to +125
o
C
T
STG
Storage Temperature -55 to +125
o
C
P
T
Power Dissipation 2.0 W
I
OUT
DC Output Current 50 mA
4878 tbl 06
Symbol Parameter
(1)
Conditions Max. Unit
C
IN
Input Capacitance V
IN
= 3dV 5 pF
C
I/O
I/O Capacitance V
OUT
= 3dV 7 pF
4878 tbl 07
119 BGA Capacitance
(1)
(TA = +25°C, f = 1.0MHz)
Symbol Parameter
(1 )
Conditions Max. Unit
C
IN
Input Capacitance V
IN
= 3dV 7 pF
C
I/O
I/O Capacitance V
OUT
= 3dV 7 pF
4878 tbl 07a
165 fBGA Capacitance
(1)
(TA = +25°C, f = 1.0MHz)
Symbol Parameter
(1 )
Conditions Max. Unit
C
IN
Input Capacitance V
IN
= 3dV TBD pF
C
I/O
I/O Capacitance V
OUT
= 3dV TBD pF
4878 tbl 07b

IDT71V2559S75BG

Mfr. #:
Manufacturer:
Description:
IC SRAM 4.5M PARALLEL 119PBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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