LV8731V
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5
Substrate Specifications (Substrate recommended for operation of LV8731V)
Size: 90 mm × 90 mm × 1.6 mm (two−layer substrate [2S0P])
Material: Glass epoxy
Copper wiring density: L1 = 85% / L2 = 90%
Figure 2. L1: Copper Wiring Pattern Diagram Figure 3. L2: Copper Wiring Pattern Diagram
Cautions
1. The data for the case with the Exposed Die−Pad
substrate mounted shows the values when 90% or
more of the Exposed Die−Pad is wet
2. For the set design, employ the derating design with
sufficient margin.
Stresses to be derated include the voltage, current,
junction temperature, power loss, and mechanical
stresses such as vibration, impact, and tension.
Accordingly, the design must ensure these stresses
to be as low or small as possible.
The guideline for ordinary derating is shown
below :
(1) Maximum value 80% or less for the voltage
rating
(2) Maximum value 80% or less for the current
rating
(3) Maximum value 80% or less for the
temperature rating
3. After the set design, be sure to verify the design
with the actual product.
Confirm the solder joint state and verify also the
reliability of solder joint for the Exposed Die−Pad,
etc.
Any void or deterioration, if observed in the solder
joint of these parts, causes deteriorated thermal
conduction, possibly resulting in thermal
destruction of IC
