BENEFITS
• Scalability: Single solution for mesh, fabric, and
aggregated systems
•
Performance: Improved system and distributed
processing performance
•
Power: SerDes implementation for low power solution
Specifications
• Technology: 0.13um
• Voltage: 1.2V and 3.3V
• Low power consumption
• Package: 399 ball, 21mm x 21mm,
1mm ball pitch FCBGA
• Rated for commercial and industrial temperatures
•
Forward compatible with the Tsi564A Serial RapidIO
Switch allowing easy migration for existing systems.
Target Markets
• Wireless Infrastructure
– Node B, Radio Network Controller,
Media Gateway
• Communications Wireline Infrastructure
– Multiservice WAN Switches, 1 to 10 Gbit
Ethernet Switches, 1 to >10Gbit Routers, DSLAMs
• Storage
–
Storage Area Networks, Network Attached Storage,
High-Performance Work Stations, Multi-service
Access Nodes, Carrier-grade VoIP
• Video Infrastructure
– Broadcast, imaging, and encoding
– Architecture Standards
– ATCA, MicroTCA, VXS, VPX
IDT
|
THE ANALOG
+
DIGITAL COMPANY TSI574
SERIAL RAPIDIO SWITCH PRODUCT BRIEF
Integrated DeviceTechnology
2
Tsi574
™
Serial RapidIO Switch
POWER MANAGEMENT
|
ANALOG & RF
|
INTERFACE & CONNECTIVITY
|
CLOCKS & TIMING
|
MEMORY & LOGIC
|
TOUCH & USER INTERFACE
|
VIDEO & DISPLAY
|
AUDIO
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters
of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied
warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. © Copyright 2011. All rights reserved.
PB TSI574 SRIO SWCH PB REV50311
Discover what IDT know-how
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Tsi574
®
DSP
DSP
Dual
Serial
RapidIO
AMC Slot
AMC Slot
Tsi574
®
Tsi574
®
AMC Slot
AMC Slot
Serial RapidIO Mesh
Processor Farm Mezzanine
Switch Carrier Blade
Typical Applications
The Tsi574 can be used in many embedded communication applications. It provides chip-to-chip
interconnect between I/O devices and can replace existing proprietary backplane fabrics for
board-to-board interconnect which improves system cost and product time-to-market.
The Tsi574 provides traffic aggregation through packet prioritization when it is used with RapidIO-
enabled I/O devices. When it is in a system with multiple RapidIO-enabled processors it provides
high performance peer-to-peer communication through its non-blocking switch fabric.