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4
Table 4. DC ELECTRICAL SPECIFICATIONS (Note 1)
Parameter
Symbol Conditions/Description Min Typ Max Units
OVERALL
Supply current, dynamic
I
DD
CMOS mode; F
XTAL
= 15 MHz; F
VCO
= 400 MHz; F
CLK
= 200 MHz; does
not include load current
35 mA
Supply current, static I
DDL
SHUT1, SHUT2 bit both “1” 400 700
mA
SERIAL COMMUNICATION I/O (SDA, SCL)
Highlevel input voltage
V
IH
0.8*V
DD
V
Lowlevel input voltage V
IL
0.2*V
DD
V
Hysteresis voltage V
hys
0.33*V
DD
V
Input leakage current I
I
SDA, SCL in read condition 10 +10
mA
Lowlevel output sink current (SDA) I
OL
SDA in acknowledge condition;
V
SDA
= 0.4 V
5 14 mA
ADDRESS SELECT INPUT (ADDR0, ADDR1)
Highlevel input voltage
V
IH
V
DD
1.0 V
Lowlevel input voltage V
IL
0.8 V
Highlevel input current (pulldown) I
IH
V
ADDRx
= V
DD
30
mA
Lowlevel input current I
IL
V
ADDRx
= 0 V 1 1
mA
REFERENCE FREQUENCY INPUT (REF)
Highlevel input voltage
V
IH
V
DD
1.0 V
Lowlevel input voltage V
IL
0.8 V
Highlevel input current I
IH
V
REF
= V
DD
1 1
mA
Lowlevel input current (pulldown) I
IL
V
REF
= 0 V 30
mA
SYNC CONTROL INPUT (SYNC)
Highlevel input voltage
V
IH
V
DD
1.0 V
Lowlevel input voltage V
IL
0.8 V
Highlevel input current I
IH
V
REF
= V
DD
1 1
mA
Lowlevel input current (pulldown) I
IL
V
REF
= 0 V 30
mA
CRYSTAL OSCILLATOR INPUT (XIN)
Threshold bias voltage
V
TH
V
DD
/2 V
Highlevel input current I
IH
V
XIN
= V
DD
40
mA
Lowlevel input current I
IL
V
XIN
= GND 40
mA
Crystal frequency F
X
Fundamental mode 35 MHz
Recommended crystal load
capacitance*
C
L(XTAL)
For best matching with internal crystal
oscillator load
1618 pF
CRYSTAL OSCILLATOR OUTPUT (XOUT)
Highlevel output source current
I
OH
V
XOUT
= 0 8.5 mA
Lowlevel output sink current I
OL
V
XOUT
= V
DD
11 mA
PECL CURRENT PROGRAM I/O (IPRG)
Lowlevel input current
I
IL
V
IPRG
= 0 V; PECL mode 10 10
mA
CLOCK OUTPUTS, CMOS MODE (CLKN, CLKP)
Highlevel output source current
I
OH
V
O
= 2.0 V 19 mA
1. Unless otherwise stated, V
DD
= 3.3 V ± 10%, no load on any output, and ambient temperature range T
A
= 0°C to 70°C. Parameters denoted
with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. MIN and MAX characteriza-
tion data are ± 3s from typical. Negative currents indicate flows out of the device.
FS7140, FS7145
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5
Table 4. DC ELECTRICAL SPECIFICATIONS (Note 1)
Parameter UnitsMaxTypMinConditions/DescriptionSymbol
CLOCK OUTPUTS, CMOS MODE (CLKN, CLKP)
Lowlevel output sink current
I
OL
V
O
= 0.4 V 35 mA
CLOCK OUTPUTS, PECL MODE (CLKN, CLKP)
IPRG bias voltage
V
IPRG
V
IPRG
will be clamped to this level
when a resistor is connected from
VDD to IPRG
V
DD
/3 V
IPRG bias current I
IPRG
I
IPRG
(V
VDD
V
IPRG
) / R
SET
3.5 mA
Sink current to IPRG current ratio 13
Tristate output current I
Z
10 10
mA
1. Unless otherwise stated, V
DD
= 3.3 V ± 10%, no load on any output, and ambient temperature range T
A
= 0°C to 70°C. Parameters denoted
with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. MIN and MAX characteriza-
tion data are ± 3s from typical. Negative currents indicate flows out of the device.
Table 5. AC TIMING SPECIFICATIONS (Note 2)
Parameter
Symbol Conditions/Description Min Typ Max Units
OVERALL
Output frequency*
f
o(max)
CMOS outputs
0 150
MHz
PECL outputs
0 300
VCO frequency* f
VCO
40 400 MHz
CMOS mode rise time* t
r
C
L
= 7 pF 1 ns
CMOS mode fall time* t
f
C
L
= 7 pF 1 ns
PECL mode rise time* t
r
C
L
= 7 pF; R
L
= 65 ohm 1 ns
PECL mode fall time* t
f
C
L
= 7 pF; R
L
= 65 ohm 1 ns
REFERENCE FREQUENCY INPUT (REF)
Input frequency
F
REF
80 MHz
Reference high time t
REHF
3 ns
Reference low time t
REFL
3 ns
SYNC CONTROL INPUT (SYNC)
Sync high time
t
SYNCH
For orderly CLK stop/start
3
T
CLK
Sync low time t
SYNCL
For orderly CLK stop/start
3
CLOCK OUTPUT (CLKN, CLKP)
Duty cycle (CMOS mode)*
Measured at 1.4 V 50 %
Duty cycle (PECL mode)* Measured at zero crossings of
(V
CLKP
V
CLKN
)
50 %
Jitter, long term (s
y
(t))*
t
j(LT)
For valid programming solutions. Long-term (or cumulative) jitter specified is
RMS position error of any edge compared with an ideal clock generated from
the same reference frequency. It is measured with a time interval analyzer us-
ing a 500 microsecond window, using statistics gathered over 1000 samples.
ps
FREF/NREF > 1000 kHz
25 ps
FREF/NREF ^ 500 kHz
50 ps
FREF/NREF ^ 250 kHz
100 ps
FREF/NREF ^ 125 kHz
190 ps
FREF/NREF ^ 62.5 kHz
240 ps
FREF/NREF ^ 31.5 kHz
300 ps
Jitter, period (peakpeak)*
t
j(
D
P)
40 MHz < VCO frequency < 100 MHz
75 ps
VCO frequency > 100 MHz
50 ps
2. Unless otherwise stated, V
DD
= 3.3 V ± 10%, no load on any output, and ambient temperature range T
A
= 0°C to 70°C. Parameters denoted
with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. MIN and MAX characterization
data are ± 3s from typical.
FS7140, FS7145
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6
Table 6. SERIAL INTERFACE TIMING SPECIFICATIONS (Note 3)
Parameter
Symbol Conditions/Description
Fast Mode
Units
Min Max
Clock frequency f
SCL
SCL 0 400 kHz
Bus free time between STOP and START t
BUF
1300 ns
Setup time, START (repeated) T
su:STA
600 ns
Hold time, START t
hd:STA
600 ns
Setup time, data input T
su:DAT
SDA 100 ns
Hold time, data input t
hd:DAT
SDA 0 ns
Output data valid from clock t
AA
900 ns
Rise time, data and clock t
R
SDA, SCL 300 ns
Fall time, data and clock t
F
SDA, SCL 300 ns
High time, clock t
HI
SCL 600 ns
Low time, clock t
LO
SCL 1300 ns
Setup time, STOP t
su:STO
600 ns
3. Unless otherwise stated, V
DD
= 3.3 V ± 10%, no load on any output, and ambient temperature range T
A
= 0°C to 70°C. Parameters denoted
with an asterisk (*) represent nominal characterization data and are not production tested to any specific limits. MIN and MAX characterization
data are ± 3s from typical.
FUNCTIONAL BLOCK DIAGRAM
Phase Locked Loop (PLL)
The PLL is a standard phase and frequencylocked loop
architecture. The PLL consists of a reference divider, a
phasefrequency detector (PFD), a charge pump, an internal
loop filter, a voltagecontrolled oscillator (VCO), a
feedback divider, and a post divider.
The reference frequency (generated by either the
onboard crystal oscillator or an external frequency source),
is first reduced by the reference divider. The integer value
that the frequency is divided by is called the modulus and is
denoted as NR for the reference divider. This divided
reference is then fed into the PFD.
The VCO frequency is fed back to the PFD through the
feedback divider (the modulus is denoted by NF).
The PFD will drive the VCO up or down in frequency until
the divided reference frequency and the divided VCO
frequency appearing at the inputs of the PFD are equal. The
input/output relationship between the reference frequency
and the VCO frequency is then:
f
VCO
N
F
+
f
REF
N
R
This basic PLL equation can be rewritten as
f
VCO
+ f
REF
ǒ
N
F
N
R
Ǔ
A post divider (actually a series combination of three post
dividers) follows the PLL and the final equation for device
output frequency is:
f
CLK
+ f
REF
ǒ
N
F
N
R
Ǔǒ
1
N
Px
Ǔ
Reference Divider
The reference divider is designed for low phase jitter. The
divider accepts the output of either the crystal oscillator
circuit or an external reference frequency. The reference
divider is a 12 bit divider, and can be programmed for any
modulus from 1 to 4095 (divide by 1 not available on date
codes prior to 0108).
Feedback Divider
The feedback divider is based on a dualmodulus divider
(also called dualmodulus prescaler) technique. It permits
division by any integer value between 12 and 16383. Simply
program the FBKDIV register with the binary equivalent of
the desired modulus. Selected moduli below 12 are also
permitted. Moduli of: 4, 5, 8, 9, and 10 are also allowed (4
and 5 are not available on date codes prior to 0108).
Post Divider
The post divider consists of three individually
programmable dividers, as shown in Figure 2.

FS7140-02G-XTD

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Generators & Support Products I2C PLL CLOCK 3.3V
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