The double-level headers of the MINI and MICRO-
COMBICON series are characterized by their low space
requirement and high contact density. The new high-
temperature resistant versions, MCD(V) 0,5-HT and
MCD(V) 1,5-HT, extend the performance spectrum of
these components – they are suitable for use with the
PIN AND PASTE process and can be reflow soldered.
In line with the advantages of the Through Hole method,
it is thus possible to process SMD components at the
same time. Subsequent processes previously
necessary, such as wave soldering, are thus
unnecessary.
The housing dimensions are not generally common to
the THR method, and the double-level HT headers are
thus a particular challenge to the SMT process.
Further details on how to optimize the process
parameters are available on request.
COMBICON Headers for Through Hole
Reflow Applications MCD(V) 0,5/…G1-2,5 HT BK
and MCD(V) 1,5/…G1-3,81 HT BK
2.5 or 3.81 mm Pitch
Phoenix Contact GmbH & Co. KG • 32823 Blomberg, Germany
Phone +49 52 35 3-00 • Fax +49 52 35 3-4 12 00 • www.phoenixcontact.com
COMBICON Select
The COMBICON search engine with CAD downloading
COMBICON Select – the printed circuit board connection software
supports your workflow from the PCB and housing layout to the
ordering process with:
–Systematic and fast selection of products
–Universal Internet aided engineering with extensive
CAD downloading
–Easy-to-use e-shopping functions.
http://select.phoenixcontact.com
