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MPXH6250A6T1

P1-P3P4-P6P7-P9P10-P12P13-P14
MPXH6250A
Sensors
Freescale Semiconductor, Inc. 7
4 Package Information
4.1 Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SSOP footprint
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXH6250A
Sensors
8 Freescale Semiconductor, Inc.
4.2 Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, small outline package, surface mount
MPXH6250A
Sensors
Freescale Semiconductor, Inc. 9
Case 98ARH99066A, small outline package, surface mount
P1-P3P4-P6P7-P9P10-P12P13-P14

MPXH6250A6T1

Mfr. #:
Buy MPXH6250A6T1
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SSOP INTEGRATED
Lifecycle:
New from this manufacturer.
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