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145
Test Method Maximum ∆R
Short Time
Overload
1.14 x √P*R / 10 sec @ 70°C Max % ∆Rsto =
±(2% + 0.05Ω)
Moisture
Resistance
(TA1K0) 1000 hrs @ 40°C, 90-95% RH
(TA2K0) 1750 hrs @ 40°C, 90-95% RH
≤1%
≤1%
Thermal Shock
MIL-STD-202, Method 107 MIL-STD-202,
Method 107
Vibration, elec.
MIL-STD-202, Method 201 ±2% Resistance
Vibration, mech.
MIL-STD-202, Method 201 No Loose
Terminal Screws
Load Life
(TA1K0) 1000 Hrs 90 min ON / 30 min OFF
(TA2K0) 1750 Hrs 90 min ON / 30 min OFF
≤1%
≤1%
Pulse Tolerance
52µF @ 2KV / 60 sec intervals, 104J,
20,000 Pulses
≤1%
Dielectric
Strength
6KVDC for 1 minute ≤1%
TA 1K0PH2R50KE
Style Package
Type
Resistance
2.5Ω = 2R50
50Ω = 50R0
Tolerance
K = 10% (standard)
L = 20%
Wattage
RoHS Compliant
0.798"
(20.26mm)
3.000"
(76.20mm)
ø10-32
1.308"
(33.21mm)
0.193"
(4.89mm)
1.622"
(41.20mm)
0.689"
(17.50mm)
ø0.172"
(4.37mm)
0.450"
(11.43mm)
0.300"
(7.62mm)
0.188"
(4.76mm)
1.308"
(33.21mm)
(same dimensions)
1000 Watt
Ohms 10% Tolerance
0.5 TA1K0PHR500KE
1 TA1K0PH1R00KE
2.5 TA1K0PH2R50KE
5 TA1K0PH5R00KE
7.5 TA1K0PH7R50KE
10 TA1K0PH10R0KE
15 TA1K0PH15R0KE
25 TA1K0PH25R0KE
50 TA1K0PH50R0KE
100 TA1K0PH100RKE
250 TA1K0PH250RKE
500 TA1K0PH500RKE
750 TA1K0PH750RKE
1000 TA1K0PH1K00KE
2000 Watt
Ohms 10% Tolerance
0.5 TA2K0PHR500KE
1 TA2K0PH1R00KE
2.5 TA2K0PH2R50KE
5 TA2K0PH5R00KE
7.5 TA2K0PH7R50KE
10 TA2K0PH10R0KE
15 TA2K0PH15R0KE
25 TA2K0PH25R0KE
50 TA2K0PH50R0KE
100 TA2K0PH100RKE
250 TA2K0PH250RKE
500 TA2K0PH500RKE
750 TA2K0PH750RKE
1000 TA2K0PH1K00KE
APPlicATion noTes
Proper heat sinking techniques are essential to performance of
a TAP resistor. Pleased follow these guidelines when designing
TAP system:
• Heats sink plate (base plate of the resistor) temperature
must be monitored to establish proper de-rating. Best tech-
nique is to attach a thermocouple to the side of the base
plate of the resistor. Temperature of plastic housing or heat
sink cannot be used to establish rating of the resistor. Usage
of laser thermometers should be avoided.
• To obtain a power rating of 1000W or 2000W, the bottom
case temp must not exceed 85°C. This can only be achieved
if the thermal conduction to the heatsink Rth-cs<0.025°K/W.
This value can be reached by using thermal transfer com-
pound with a heat conductivity of 1W/mK. The flatness of
the cooling plate must be better than 0.05mm overall. The
roughness of the surface should not exceed 6.4µm.
• Due to very high power density, only liquid cooled heat sinks
are recommended for applications when >300W power rating
is desired.
• Properly designed heat sink should have more than 2 cooling
pipes under the surface of the TAP resistor. The Ohmite CP4
heat sink (http://www.ohmite.com/cat/sink_cp4.pdf) is an
example of properly designed heat sink.
TAP1000 & 2000
1000 & 2000 Watt Heat Sinkable Planar
Standard Part Numbers
ordering inFormATion
dimensions
(in./mm)
