HC2LP RECOMMENDED
FOR NEW DESIGNS
Description
• Compact footprint for high density, high
current/low voltage applications
•
Foil technology that adds higher reliability factor
over the traditional magnet wire used for higher
frequency circuit designs
• Frequency Range up to 1MHz
Applications
• Next generation microprocessors
• Energy storage applications
• DC-DC converters
• Computers
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating ambient temperature range: -40°C to +85°C
(range is application specific).
• Solder reflow temperature: +260°C for 10 seconds
maximum
Packaging
• 45 parts per tray bulk packaging.
• Tape and reel packaging also available, 44mm width,
110 parts per 13" reel.
• Add -TR after part number for tape and reel packaging.
Part Rated OCL (1) Irms (2) Isat (3) DCR (4) Volts (5)
Number Inductance µH ± 20% Amperes Amperes Ohms µSec
µH (Typ.) (Typ.) (Max.)
HC2-R47-R .47 .52 52.9 63.75 .0006 6.87
HC2-R68-R .68 .63 52.9 50.00 .0006 6.87
HC2-1R0-R 1.0 1.15 33.0 42.50 .0013 10.31
HC2-2R2-R 2.2 2.00 24.3 31.90 .0023 13.75
HC2-4R7-R 4.7 4.55 17.0 21.25 .0046 20.62
HC2-6R0-R 6.0 6.00 17.0 16.50 .0046 20.62
1) Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc
2) DC current for an approximate temperature change of 40°C without core loss.
Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow and proximity of other heat
generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 125°C under
worst case operating conditions verified in the end application.
3) Peak current for approximately 30% roll-off
4) Values @ 20°C
5) Applied Volt-Time product (V-µS) across the inductor. This value represents the
applied V-µS at 300KHz necessary to generate a core loss equal to 10% of the
total losses for 40°C temperature rise.
HIGH CURRENT 2™
Power Inductors
Mechanical Diagrams
RECOMMENDED PCB PAD LAYOUT
Dimensions in Millimeters
