PS2701-1
1.2
0.6
0.0
0.8
1.0
0.4
0.2
025
50
100–50 –25
75
Ambient Temperature T
A
(°C)
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR
Normalized to 1.0
at T
A
= 25°C,
I
F
= 5 mA, V
CE
= 5 V
300
250
150
50
0
200
100
0.05 0.5 5
50
0.1 1 10
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
V
CE
= 5 V
Load Resistance R
L
()
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
V
CC
= 5 V,
I
C
= 2 mA
100
0.5
0.1
50
10
5
1
50 200 1 k
2 k
100 500
Load Resistance R
L
()
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
t
on
t
off
t
d
t
s
1.2
0.4
0.0
0.8
0.6
0.2
1.0
20
500
5 10 2002 50 100
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
R
L
= 1 k
510
300
100
1.2
1.0
0.0
0.4
0.2
0.8
0.6
10
2
10
3
110
4
10
5
10
6
Time (Hr)
LONG TERM CTR DEGRADATION
CTR (Relative Value)
I
F
= 1 mA, T
A
= 25°C
I
F
= 5 mA, T
A
= 25°C
I
F
= 20 mA, T
A
= 25°C
I
F
= 20 mA, T
A
= 60°C
I
F
= 5 mA, V
CC
= 5 V,
CTR = 169%
1 000
0.5
100
500
10
1
50
5
0.1
100 1 k 10 k 50 k500 5 k 100 k
t
f
t
s
t
r
t
d
Remark The graphs indicate nominal characteristics.
Data Sheet PN10240EJ03V0DS
7
PS2701-1
TAPING SPECIFICATIONS (in millimeters)
Tape Direction
Outline and Dimensions (Reel)
Packing: 3 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS2701-1-F3
PS2701-1-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
4.6±0.1
2.9 MAX.
0.3
8.0±0.1
Outline and Dimensions (Tape)
2.4±0.1
1.5
+0.1
–0
7.4±0.1
5.5±0.05
12.0±0.2
Data Sheet PN10240EJ03V0DS
8
PS2701-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10240EJ03V0DS
9

PS2701-1-F3-L-A

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
Transistor Output Optocouplers Hi-Iso Photo 1-Ch
Lifecycle:
New from this manufacturer.
Delivery:
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