NL17SZ07XV5T2G

NL17SZ07
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4
AC ELECTRICAL CHARACTERISTICS t
R
= t
F
= 2.5 ns; C
L
= 50 pF; R
L
= 500 W
Symbo
l
Parameter Condition V
CC
(V)
T
A
= 25°C 55°C T
A
125°C
Uni
t
Min Typ Max Min Max
t
PZL
Propagation Delay
(Figure 3 and 4)
R
L
=
R
1
= 500 W, C
L
= 50 pF 1.8 ± 0.15 0.8 5.3 11.6 0.8 12.0
ns
2.5 ± 0.2 1.2 3.7 5.8 1.2 6.4
3.3 ± 0.3 0.8 2.9 4.4 0.8 4.8
5.0 ± 0.5 0.5 2.3 3.5 0.5 3.9
t
PLZ
Propagation Delay
(Figure 3 and 4)
R
L
=
R
1
= 500 W, C
L
= 50 pF 1.8 ± 0.15 0.8 5.3 11.6 0.8 1.20
ns
2.5 ± 0.2 1.2 2.8 5.8 1.2 6.4
3.3 ± 0.3 0.8 2.1 4.4 0.8 4.8
5.0 ± 0.5 0.5 1.4 3.5 0.5 3.9
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
IN
Input Capacitance V
CC
= 5.5 V, V
I
= 0 V or V
CC
u2.5 pF
C
OUT
Output Capacitance V
CC
= 5.5 V, V
I
= 0 V or V
CC
4.0 pF
C
PD
Power Dissipation Capacitance (Note 6) 10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
4.0 pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
) I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
) I
CC
V
CC
.
Figure 3. Switching Waveforms
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
R
T
= Z
OUT
of pulse generator (typically 50 Ω)
Figure 4. Test Circuit
50%
50% V
CC
t
PZL
t
PLZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
)0.3 V
A
Y
V
CC
2
R
1
NL17SZ07
www.onsemi.com
5
DEVICE ORDERING INFORMATION
Device Package Shipping
NL17SZ07DFT2G SOT−353/SC70−5/SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SZ07XV5T2G SOT−553
(Pb−Free)
4000 / Tape & Reel
NL17SZ07P5T5G SOT−953
(Pb−Free)
8000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NL17SZ07
www.onsemi.com
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H --- 0.10---0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
B0.2 (0.008)
MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒ
mm
inches
Ǔ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

NL17SZ07XV5T2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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