LX5552LU

LX5552
PRODUCTION DATA SHEET
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
WWW.Microsemi .COM
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier, LNA & SPDT Switch
TM
®
Copyright © 2009
Rev. 1.0, 2009-06-02
DESCRIPTION
LX5552 is a high-integration, high-
performance WLAN front-end module
(FEM) for 802.11b/g/n and other
applications in the 2.4-2.5GHz
frequency range. LX5552 integrates a
fully matched InGaP/GaAs Hetero-
junction Bipolar Transistor (HBT)
power amplifier, a low noise amplifier
based on InGaAs Enhancement mode
pseudo-morphic high electron
mobility transistor (E-pHEMT)
technology, and a low-cost Depletion
mode pHEMT (D-pHEMT) single
pole double throw (SPDT) antenna
switch in a single package.
The Tx path of LX5552 features a
two-stage monolithic microwave
integrated circuit (MMIC) power
amplifier with active bias circuitry,
on-chip output power detector, and
50Ω input/output matching inside the
package. With 3.3V supply voltage
and 80mA bias current, the Tx path
provides about 26dB power gain and
+17dBm linear output power, with low
total EVM (<3%) for 64QAM/ 54Mbps
OFDM. Both gain and power are
readily measured at antenna port with
the insertion loss of the Tx switch
included.
The Rx path of LX5552 features
small-signal gain of 12.5dB, low noise
figure of 2dB, and high input third-
order intercept point (IIP3) of +5dBm
with the insertion loss of the the Rx
switch loss included. The LNA
consumes about 10mA current with
3.3V supply voltage.
LX5552 is available in a 16-pin,
3x3mm micro-lead package (MLPQ-
16L). With its high level of functional
integration, best-class performance,
compact footprint and low profile,
LX5552 offers an ideal front-end
solution for the ever demanding design
requirements of today’s WLAN
systems, including 802.11b/g and the
latest 11n MIMO applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
All RF I/O Matched to 50 Ω
Single-Polarity 3.3V Supply
Small Footprint: 3x3mm
2
Low Profile: 0.55mm
RoHS Compliant & Pb-Free
TX Features :
Power Gain ~ 26dB*
Pout ~ +17dBm* for 3% EVM
Current ~140mA at +17dBm
Pout ~ +21dBm* for 11b
1Mbps DSSS Mask
Compliance
Quiescent Current ~ 80mA
RX Features :
Gain ~ 12.5dB*
Noise Figure ~ 2dB*
IIP3 ~ +5dBm*
* Including SPDT switch loss
APPLICATIONS
IEEE 802.11b/g
IEEE 802.11n MIMO
BLOCK DIAGRAM
L
L
X
X
5
5
5
5
5
5
2
2
*IMN:
Input Matching Network
*OMN:
Output Matching Network
Vref
TxIn
Antenna
Port
Vc1
Det
CtrlTx
CtrlRx
Vdd
RxOut
IMN*
PA
PA
Out
SwIn
OMN*
Vc2
LNA
*IMN:
Input Matching Network
*OMN:
Output Matching Network
Vref
TxIn
Antenna
Port
Vc1
Det
CtrlTx
CtrlRx
Vdd
RxOut
IMN*
PA
PA
Out
SwIn
OMN*
Vc2
LNA
LX5552
PRODUCTION DATA SHEET
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
WWW.Microsemi .COM
2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier, LNA & SPDT Switch
TM
®
Copyright © 2009
Rev. 1.0, 2009-06-02
PRODUCT HIGHLIGHT
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off (PA).......................................................................5V
(LNA) ...................................................................4V
(Switch) ................................................................5V
Collector Current (PA)................................................................................500mA
Drain Current (LNA) ....................................................................................40mA
Total Power Dissipation....................................................................................2W
RF Input Power (With 50 Ohm Load at Output) ......................................+10dBm
Maximum Junction Temperature (Tj max)................................................+150°C
Operation Ambient Temperature...................................................-40°C to +85°C
Storage Temperature....................................................................-65°C to +150°C
RoHS/Pb-Free Peak Package Temp. for Solder Reflow
(40 seconds maximum exposure)................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
THERMAL DATA
LU
Plastic MLPQ 16-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, θ
JC
9.5 C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ
JA
50.0 C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x θ
JA
).
The θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OUT
LU PACKAGE
(“See-Through” View from Top)
RoHS/Pb-Free 100% Matte Tin Lead finish
PACKAGE ORDER INFO
LU
Plastic MLPQ
16 pin 3x3mm
RoHS Compliant /Pb-Free
LX5552LU
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5552LU-TR)
MSC
5552
818A
MSC
5552
840A
MSC
5552
818A
MSC
5552
840A
Vcc
1
2
3
9
12
11
10
4
5678
13
14
15
16
Vref
Det
RxOut
Vc2
PAOut
SwIn
NC
Vdd CtrlRx
Ant CtrlTx
TxIn
Vc1
NC
NC
GND
Vcc
1
2
3
9
12
11
10
4
5678
13
14
15
16
Vref
Det
RxOut
Vc2
PAOut
SwIn
NC
Vdd CtrlRx
Ant CtrlTx
TxIn
Vc1
NC
NC
GND
P
P
A
A
C
C
K
K
A
A
G
G
E
E
D
D
A
A
T
T
A
A
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
TM
®
WWW.Microsemi .COM
Copyright
INFORMATION
Thank you for your interest in Microsemi
®
Analog Mixed Signal products.
The full data sheet for this device contains proprietary information.
To obtain a copy, please contact your local Microsemi sales representative. The
name of your local representative can be obtained at the following link
http://www.microsemi.com/contact/contactfind.asp
or
Contact us directly by sending an email to:
IPGdatasheets@microsemi.com
Be sure to specify the data sheet you are requesting and include your company
name and contact information and or vcard.
We look forward to hearing from you.

LX5552LU

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
RF Amplifier LX5552LU
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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