IRF840APBF

www.vishay.com Document Number: 91065
4 S11-0506-Rev. B, 21-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF840A, SiHF840A
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 8 - Maximum Safe Operating Area
1
1
10
2
10
3
10
2
91065_05
Capacitance (pF)
V
DS
,
Drain-to-Source Voltage (V)
C
iss
C
rss
C
oss
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
Shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
10
10
10
5
10
4
10
3
91065_06
Q
G
, Total Gate Charge (nC)
V
GS
, Gate-to-Source Voltage (V)
20
16
12
8
0
4
0
10
40
30
20
I
D
= 8.0 A
V
DS
= 100 V
V
DS
= 250 V
For test circuit
see figure 13
V
DS
= 400 V
91065_07
V
GS
= 0 V
V
SD
, Source-to-Drain Voltage (V)
I
SD
, Reverse Drain Current (A)
10
2
10
1
0.1
0.2
0.5 0.8
1.4
1.1
T
J
= 25 °C
T
J
= 150 °C
10
2
91065_08
10 µs
100 µs
1 ms
10 ms
Operation in this area limited
by R
DS(on)
T
C
= 25 °C
T
J
= 150 °C
Single Pulse
V
DS
, Drain-to-Source Voltage (V)
I
D
, Drain Current (A)
10
1
0.1
10
4
10
10
3
10
2
Document Number: 91065 www.vishay.com
S11-0506-Rev. B, 21-Mar-11 5
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF840A, SiHF840A
Vishay Siliconix
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10a - Switching Time Test Circuit
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
91065_09
I
D
, Drain Current (A)
T
C
, Case Temperature (°C)
0.0
2.0
4.0
8.0
6.0
25 1501251007550
Pulse width 1 µs
Duty factor 0.1 %
R
D
V
GS
R
G
D.U.T.
10 V
+
-
V
DS
V
DD
V
DS
90 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
0.1 1
91065_11
Thermal Response (Z
thJC
)
t
1
, Rectangular Pulse Duration (s)
10
1
0.1
10
-2
10
-4
10
-3
10
-2
D = 0.5
0.2
0.1
0.05
0.02
0.01
P
DM
t
1
t
2
Notes:
1. Duty Factor, D = t
1
/t
2
2. Peak T
j
= P
DM
x Z
thJC
+ T
C
Single Pulse
(Thermal Response)
10
-5
www.vishay.com Document Number: 91065
6 S11-0506-Rev. B, 21-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF840A, SiHF840A
Vishay Siliconix
Fig. 12a - Unclamped Inductive Test Circuit
Fig. 12b - Unclamped Inductive Waveforms
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Fig. 12d - Basic Gate Charge Waveform
Fig. 13a - Typical Drain-to-Source Voltage vs.
Avalanche Current
Fig. 13b - Gate Charge Test Circuit
R
G
I
AS
0.01 Ω
t
p
D.U.T
L
V
DS
+
-
V
DD
10 V
Var y t
p
to obtain
required I
AS
I
AS
V
DS
V
DD
V
DS
t
p
91065_12c
1000
0
200
400
600
800
25 150
125
10075
50
Starting T
J
, Junction Temperature (°C)
E
AS
, Single Pulse Avalanche Energy (mJ)
1200
Bottom
To p
I
D
3.6 A
5.1 A
8.0 A
Q
GS
Q
GD
Q
G
V
G
Charge
10 V
91065_12d
580
520
540
560
0.0 5.0
4.0
3.02.0
1.0
I
AV
, Avalanche Current (A)
V
DSav
, Avalanche Voltage (V)
600
8.0
7.0
6.0
D.U.T.
3 mA
V
GS
V
DS
I
G
I
D
0.3 µF
0.2 µF
50 kΩ
12 V
Current regulator
Current sampling resistors
Same type as D.U.T.
+
-

IRF840APBF

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET N-CH 500V HEXFET MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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