DATA SHEET • CLA4608-085LF SURFACE MOUNT LIMITER DIODE
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 July 17, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202537C
Typical Performance Characteristics
(TA = 25 °C, Unless Otherwise Noted)
Figure 4. Typical Insertion Loss vs Input Power
(Board Loss Included; RF Choke, 10 nH, and 1000 pF DC Blocks Used)
High Power Limiter Design Application
The CLA4608-085LF PIN limiter diode is designed for shunt
applications in receiver protection power limiter circuits.
Compared to other surface mount packages, the design of the
QFN package produces lower thermal resistance and also reduces
the effects of the parasitic inductance of the anode bond wires.
A cross-sectional view of the CLA4608-085LF PIN limiter diode is
shown in Figure 5. The cathode of the die is soldered directly to
the top of the exposed paddle. This paddle is composed of copper,
so its thermal resistance is very low.
The copper ground paddle minimizes the total thermal resistance
between the I layer, which is the location where most heat is
generated under normal operation, and the surface to which the
package is mounted. Minimal thermal resistance between the I
layer and the external environment minimizes junction
temperature.
The electrically equivalent circuit of the CLA4608-085LF PIN
limiter diode is shown in Figure 6. The inductances of pins 1 and
2, as well as the inductances of the bond wires are in series with
the input and output transmission lines of the external circuit
rather than the portion of the circuit that contains the shunt PIN
limiter diode.
Figure 5. Cross-Sectional View of the CLA4608-085LF
