ADN2830
–10– REV. B
OUTLINE DIMENSIONS
Figure 7. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADN2830ACPZ32 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADN2830-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
REVISION HISTORY
3/12—Rev. A to Rev. B
Added EPAD Notation ..................................................................... 4
Updated Outline Dimensions ........................................................ 10
Changes to Ordering Guide ........................................................... 10
6/03—Rev. 0 to Rev. A
Changes to Absolute Maximum Ratings ........................................ 3
Updated Outline Dimensions ........................................................ 10
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03020-0-3/12(B)
