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LS P47K-H1K2-1-0-2-R18F-

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
2012-03-16 10
LS P47K, LY P47K
Empfohlenes Lötpaddesign
8)
Seite 16
Reflow Löten
Recommended Solder Pad
8) page 16
Reflow Soldering
Empfohlenes Lötpaddesign
8) Seite 16
Reflow Löten, montage von oben
Recommended Solder Pad
8) page 16
Reflow Soldering, top mount
OHAY1307
Hole in PCB
Solder resist
Lötstoplack
(ø2.1 (0.083)
2.6 (0.102)
3.6 (0.142)
(0.5 (0.020))
0.7 (0.028)
0.025 (0.001)
+0.1 (0.004)
Padgeometrie für verbesserte Wärmeableitung
Paddesign for improved heat dissipation
Bauteil positioniert, Rückseite
Component location on pad, backside
)
OHAY2629
Lötstoplack
Solder resist
ø2.3 (0.091)
2.6 (0.102)
0.2 (0.008)
0.7 (0.028)
0.8 (0.031)
No solder resist; no copper pad
Kein Lötstoplack; kein Kupfer
LS P47K, LY P47K
2012-03-16 11
Gurtung / Polarität und Lage
8)
Seite 16
Verpackungseinheit 3000/Rolle, ø180 mm
Montage von oben oder 12000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation
8) page 16
Packing unit 3000/reel, ø180 mm
top mount or 12000/reel, ø330 mm
Gurtung / Polarität und Lage
8)
Seite 16
Verpackungseinheit 3000/Rolle, ø180 mm
Montage von unten oder 12000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation
8) page 16
Packing unit 3000/reel, ø180 mm
reverse mount or 12000/reel, ø330 mm
OHAY2429
1.5 (0.059)
+0.1 (0.004)
4 (0.157)
±0.05 (0.002)
2 (0.079)
0.8 (0.031)
±0.05 (0.002)
±0.05 (0.002)
2.25 (0.089)
±0.05 (0.002)
1.75 (0.069)
±0.05 (0.002)
2.7 (0.106)
±0.05 (0.002)
3.5 (0.138)
8.1 (0.319)
±0.1 (0.004)
±0.05 (0.002)
1.1 (0.043)
Cathode/Collector Side
0.3 (0.012) max.
±0.05 (0.002)
0.95 (0.037)
(1.4 (0.055))
5˚ max.
±0.05 (0.002)
3.7 (0.146)
OHAY1306
1.5 (0.059)
+0.1 (0.004)
4 (0.157)
±0.05 (0.002)
2 (0.079)
0.8 (0.031)
±0.05 (0.002)
±0.05 (0.002)
1.5 (0.059)
±0.05 (0.002)
1.75 (0.069)
±0.05 (0.002)
2.8 (0.110)
±0.05 (0.002)
3.5 (0.138)
8.1 (0.319)
±0.1 (0.004)
±0.05 (0.002)
1.1 (0.043)
Cathode/Collector Side
0.3 (0.012) max.
±0.05 (0.002)
0.45 (0.018)
±0.05 (0.002)
1.15 (0.045)
5˚ max.
±0.05 (0.002)
3.75 (0.148)
2012-03-16 12
LS P47K, LY P47K
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020D.01)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020D.01)
Profile Feature
Pb-Free (SnAgCu) Assembly
Recommendation Max. Ratings
Ramp-up Rate to Preheat*
)
25°C to 150°C
2°C / sec 3°C / sec
Time t
s
from T
Smin
to T
Smax
(150°C to 200°C
100s min. 60sec max. 120sec
Ramp-up Rate to Peak*
)
180°C to T
P
2°C / sec 3°C / sec
Liquidus Temperture T
L
217°C
Time t
L
above T
L
80sec max. 100sec
Peak Temperature T
P
245°C max. 260°C
Time t
P
within 5°C of the specified
peak temperature T
P
- 5K
20sec min. 10sec max. 30sec
Ramp-down Rate*
T
P
to 100°C
3°K / sec 6°K / sec maximum
Time 25°C to Peak temperature max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ∆T/∆t: ∆t max. 5 sec; fulfillment for the whole T-range
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LS P47K-H1K2-1-0-2-R18F-

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Description:
LED RED CLEAR SMD BOTTOM ENTRY
Lifecycle:
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