DATASHEET
SMD Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
4
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
www.everlight.com
Device Selection Guide
Chip
Materials
Emitted Color Resin Color
InGaN
Neutral White
Warm White
Water Clear
Absolute Maximum Ratings (Ta=25
℃
)
*1
Parameter Symbol Rating Unit
Reverse Voltage*1
V
R
5
V
Forward Current*1
I
F
30
mA
Peak Forward Current(Duty 1/10 @ 1KHZ)*1
I
FP
100
mA
Power Dissipation*1
Pd
110
mW
Electrostatic Discharge(HBM) *1
ESD
1000
℃
Operating Temperature
T
opr
-40 ~ +
85
℃
Storage Temperature
Ts t g
-40 ~ +90
℃
Soldering Temperature
T
sol
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350
℃
for 3 sec.
* 1. The value are based on 1 die performance
Electro-Optical Characteristics (Ta=25℃)
Parameter Symbol Min. Typ. Max. Unit Condition
Viewing Angle
*1
2θ
1/2
----- 120 -----
deg
I
F
=20mA
*2
Reverse Current
I
R
----- ----- 50
μA V
R
=5V
*1 When three LED dies are operated simultaneously.
*2 For each die.