Philips Semiconductors Product specification
74F20Dual 4-input NAND gate
March 3, 1989
3
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER RATING UNIT
V
CC
Supply voltage –0.5 to +7.0 V
V
IN
Input voltage –0.5 to +7.0 V
I
IN
Input current –30 to +5 mA
V
OUT
Voltage applied to output in High output state –0.5 to V
CC
V
I
OUT
Current applied to output in Low output state 40 mA
T
amb
Operating free-air temperature range 0 to +70 °C
T
stg
Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
LIMITS
MIN NOM MAX
V
CC
Supply voltage 4.5 5.0 5.5 V
V
IH
High-level input voltage 2.0 V
V
IL
Low-level input voltage 0.8 V
I
IK
Input clamp current –18 mA
I
OH
High-level output current –1 mA
I
OL
Low-level output current 20 mA
T
amb
Operating free-air temperature range 0 +70 °C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
MIN TYP
2
MAX
p
V
CC
= MIN, V
IL
= MAX ±10%V
CC
2.5
OH
-
v
u
u
v
V
IH
= MIN, I
OH
= MAX ±5%V
CC
2.7 3.4
p
V
CC
= MIN, V
IL
= MAX ±10%V
CC
0.30 0.50
OL
w-
v
u
u
v
V
IH
= MIN, I
OL
= MAX ±5%V
CC
0.30 0.50
V
IK
Input clamp voltage V
CC
= MIN, I
I
= I
IK
–0.73 –1.2 V
I
I
Input current at maximum input voltage V
CC
= MAX, V
I
= 7.0V 100 µA
I
IH
High-level input current V
CC
= MAX, V
I
= 2.7V 20 µA
I
IL
Low-level input current V
CC
= MAX, V
I
= 0.5V –0.6 mA
I
OS
Short-circuit output current
3
V
CC
= MAX –60 –150 mA
pp
I
CCH
V
IN
= GND 0.9 1.4
CC
u
y
u
I
CCL
CC
=
V
IN
= 4.5V 3.4 5.1
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25°C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
