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C8051F930-G-GDI

P1-P3P4-P6P7-P9P10-P12P13-P15
C8051F930-GDI
Rev. 1.3 7
P2.5
RD
12 D I/O or
A In
D O
Port 2.5. See Port I/O section of the C8051F93x-C8051F92x data
sheet for a complete description.
Read Strobe.
P2.6
WR
9 D I/O or
A In
D O
Port 2.6. See Port I/O section of the C8051F93x-C8051F92x data
sheet for a complete description.
Write Strobe.
Table 2.1. Pin Definitions for the C8051F930-GDI (Continued)
Name
Physical
Pad
Number
Type Description
C8051F930-GDI
8 Rev. 1.3
3. Bonding Instructions
Table 3.1. Bond Pad Coordinates (Relative to Center of Die)
Physical Pad
Number
Example Package
Pin Number
(QFN-32)
Package Pin Name Physical Pad X
(µm)
Physical Pad Y
(µm)
1
Reserved* — –1013 614
2 1 DC–/GND –1013 494
3 2 GND –1013 247
4 3 VDD/DC+ –1013 92
5 4 DCEN –1013 –91
6 5 VBAT –1013 –315
7 6RST/C2CK –1013 –626
8 7 P2.7/C2D –1013 –810
9 8 P2.6/WR –810 –1013
10 9 XTAL4 –525 –1013
11 10 XTAL3 –303 –1013
12 11 P2.5/RD –54 –1013
13 12 P2.4/ALE 130 –1013
14 13 P2.3/AD11 286 –1013
15 14 P2.2/AD10 470 –1013
16 15 P2.1/AD9 626 –1013
17 16 P2.0/AD8 810 –1013
18 17 P1.7/AD7 1013 –810
19 18 P1.6/AD6 1013 –626
20 19 P1.5/AD5 1013 –470
21 20 P1.4/AD4 1013 –286
22 Reserved* — 1013 –174
23 Reserved* — 1014 –94
24 21 P1.3/AD3 1013 137
*Note: Pins marked “Reserved” should not be connected.
C8051F930-GDI
Rev. 1.3 9
25 22 P1.2/AD2 1013 279
26 23 P1.1/AD1 1013 477
27 24 P1.0/AD0 1013 619
28 25 P0.7/IREF0 1013 817
29 26 P0.6/CNVSTR 817 1013
30 27 P0.5/RX 619 1013
31 28 P0.4/TX 477 1013
32 29 P0.3/XTAL2 279 1013
33 30 P0.2/XTAL1 137 1013
34 Reserved* — –7 1013
35 Reserved* — –97 1013
36 Reserved* — –413 1013
37 Reserved* — –503 1013
38 31 P0.1/AGND –626 1013
39 32 P0.0/VREF –810 1013
Table 3.1. Bond Pad Coordinates (Relative to Center of Die) (Continued)
Physical Pad
Number
Example Package
Pin Number
(QFN-32)
Package Pin Name Physical Pad X
(µm)
Physical Pad Y
(µm)
*Note: Pins marked “Reserved” should not be connected.
P1-P3P4-P6P7-P9P10-P12P13-P15

C8051F930-G-GDI

Mfr. #:
Buy C8051F930-G-GDI
Manufacturer:
Silicon Labs
Description:
8-bit Microcontrollers - MCU Actual die quantities will vary +/- 10% of the MOQ. All orders must be in multiples of the MOQ. All parts tested to the same level as packaged parts.
Lifecycle:
New from this manufacturer.
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