MCP16301 300 mA D
2
PAK
DEMO BOARD USER’S GUIDE
© 2011 Microchip Technology Inc. DS51983A-page 17
Appendix B. Bill of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
1 C1 CAP CER 2.2 µF 50V X5R 0805 TDK
®
Corporation C2012X5R1H225K
1 C2 CAP CER 10uF 6.3V X5R 0603 Taiyo Yuden
®
JMK107BJ106MA-T
1 C3 CAP CER 0.10uF 6.3V X5R 0402 TDK Corporation C1005X5R0J104M
1 D1 DIODE SCHOTTKY 30V 1A
PWRDI-323
Diodes
®
Incorporated PD3S130HDICT-ND
1 D2 DIODE SWITCH 75V 200mW
SOD-323
Diodes Incorporated 1N4448WS-7-F
1 L1 Sheilded Power Inductor 15 µH Coilcraft
®
Inc. LPS3015-153MLB
1 PCB RoHS Compliant Bare PCB MCP16301
D
2
PAK Board
— 104-00360
1 R1 RES 1.00M OHM 1/10W 1% 0402 SMD Panasonic
®
-ECG ERJ-2RKF1004X
1 R2 RES 31.6K OHM 1/10W 1% 0402 SMD Panasonic-ECG ERJ-2RKF3162X
1 R3 RES 10.0K OHM 1/10W 1% 0402 SMD Panasonic-ECG ERJ-2RKF1002X
4TP1, TP2,
TP3, TP4
PC TEST POINT TIN SMD Harwin Inc S1751-46R
1 U1 MCP16301 High Input Buck Converter
SOT-23
Microchip Technology Inc. MCP16301T-I/CHY
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.