070215
PRODUCT APPLICATIONPRODUCT COMPOSITION
Foam
Sn/Cu Plated PI Film
Solder Paste
Pad
Printed Circuit Board
Temperature Prole Condion
Temperature Time
A 125 sec.
B
100 sec.
C
50 sec.
Cooling Stage
>60 sec.
Soft SMD Grounding Contacts
Metallized Film-over-Foam
PART NUMBER STRUCTURE
TYPICAL REFLOW CONDITIONS
Width
Ex - 050: 5mm
Width
Ex - 050: 5mm
Height
Ex - 070: 7mm
Height
Ex - 070: 7mm
Length
Ex - 100: 10mm
Length
Ex - 100: 10mm
SLH
XXX
XXX
XXX
XXX
XXX
XXX YY
YY