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67SLH050050030PI00

P1-P2
Americas: +1.800.323.3757
LHP.Sales@lairdtech.com
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LHP.Sales@lairdtech.com
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www.lairdtech.com
FEATURES
• Sn / Cu Plated PI Film outer layer
• Polymeric Foam Core

• Halogen-free per IEC-61249-2-21 standard

• Patent Pending

MARKETS



• Servers
• Printers





SMD METALLIZED FILM-OVER-FOAM GROUNDING CONTACT



processing.
Soft SMD Grounding Contacts
Metallized Film-over-Foam
Item Unit Value Test Method
 Laird Internal
 <0.06
 <0.10
 PASS UL 94 HB*
Solder Adhesion Strength

 >0.8 Laird Internal
 durometer <20 
Compression Set % <15
3574 Test D
  
 
Force/Displacement/Resistance Graph of Laird
So SMD Contact (7 mm x 7 mm rectangle shape)

 070215

                                
                               
                              
                          
                           
PRODUCT APPLICATIONPRODUCT COMPOSITION
Foam
Sn/Cu Plated PI Film

Solder Paste
Pad
Printed Circuit Board
Temperature Prole Condion
Temperature Time
A   125 sec.
B
  100 sec.
C
  50 sec.
Cooling Stage
 >60 sec.
Soft SMD Grounding Contacts
Metallized Film-over-Foam
PART NUMBER STRUCTURE
TYPICAL REFLOW CONDITIONS







Width
Ex - 050: 5mm
Width
Ex - 050: 5mm
Height
Ex - 070: 7mm
Height
Ex - 070: 7mm
Length
Ex - 100: 10mm
Length
Ex - 100: 10mm





SLH
XXX
XXX
XXX
XXX
XXX
XXX YY
YY


P1-P2

67SLH050050030PI00

Mfr. #:
Buy 67SLH050050030PI00
Manufacturer:
Laird Performance Materials
Description:
EMI Gaskets, Sheets, Absorbers & Shielding Hrgls Film-over-Foam Sn/Cu 5x5x3mm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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