2012-06-15 12
LB A67C, LT A67C
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020D.01)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020D.01)
Anm.: Das Gehäuse ist nicht für nasschemische Reinigung geeignet.
Note: Package not suitable for wetcleaning.
Profile Feature
Pb-Free (SnAgCu) Assembly
Recommendation Max. Ratings
Ramp-up Rate to Preheat*
)
25°C to 150°C
2 K/ s 3 K / s
Time t
s
from T
Smin
to T
Smax
(150°C to 200°C
100 s min. 60sec max. 120sec
Ramp-up Rate to Peak*
)
180°C to T
P
2 K/ s 3 K / s
Liquidus Temperture T
L
217°C
Time t
L
above T
L
80 s max. 100 s
Peak Temperature T
P
245 °C max. 250 °C
Time t
P
within 5°C of the specified
peak temperature T
P
- 5K
20 s min. 10 s max. 30 s
Ramp-down Rate*
T
P
to 100°C
3 K / s 6 K / s maximum
Time 25°C to Peak temperature max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ∆T/∆t: ∆t max. 5 s; fulfillment for the whole T-range
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
